Integrated Circuits (ICs)

AX250-1FGG484

Active

HIGH SPEED ANTIFUSE FPGAS

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

HIGH SPEED ANTIFUSE FPGAS

Technical Specifications

Parameters and characteristics for this part

Part	Voltage - Supply [Max]	Voltage - Supply [Min]	Package / Case	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Number of LABs/CLBs	Total RAM Bits	Number of I/O	Number of Gates	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]
Microchip Technology AX250-FGG256M	1.575 V	1.425 V	256-LBGA	Surface Mount	125 °C	-55 °C	4224	55296 Bits	138	250000	256-FPBGA (17x17)
Microchip Technology AX250-FGG256	1.575 V	1.425 V	256-LBGA	Surface Mount			4224	55296 Bits	138	250000	256-FPBGA (17x17)	70 °C	0 °C
Microchip Technology AX250-1FGG484	1.575 V	1.425 V	484-BGA	Surface Mount			4224	55296 Bits	248	250000	484-FPBGA (23x23)	70 °C	0 °C
Microchip Technology AX250-1FGG256	1.575 V	1.425 V	256-LBGA	Surface Mount			4224	55296 Bits	138	250000	256-FPBGA (17x17)	70 °C	0 °C
Microchip Technology AX250-2FG484	1.575 V	1.425 V	484-BGA	Surface Mount			4224	55296 Bits	248	250000	484-FPBGA (23x23)	70 °C	0 °C
Microchip Technology AX250-2FG256I	1.575 V	1.425 V	256-LBGA	Surface Mount			4224	55296 Bits	138	250000	256-FPBGA (17x17)	85 °C	-40 °C
Microchip Technology AX250-1FG484	1.575 V	1.425 V	484-BGA	Surface Mount			4224	55296 Bits	248	250000	484-FPBGA (23x23)	70 °C	0 °C
Microchip Technology AX250-1FG256	1.575 V	1.425 V	256-LBGA	Surface Mount			4224	55296 Bits	138	250000	256-FPBGA (17x17)	70 °C	0 °C
Microchip Technology AX250-2FGG484	1.575 V	1.425 V	484-BGA	Surface Mount			4224	55296 Bits	248	250000	484-FPBGA (23x23)	70 °C	0 °C
Microchip Technology AX250-1PQG208M	1.575 V	1.425 V	208-BFQFP	Surface Mount	125 °C	-55 °C	4224	55296 Bits	115	250000	208-PQFP (28x28)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Axcelerator®

offers high performance and unprecedented design security at density of 250K equivalent system gates.These devices

have several system-level features, such as embedded SRAM (with embedded FIFO

Technical documentation and resources