Zenode.ai Logo
Beta
Product thumbnail image
Discrete Semiconductor Products

BSM300D12P4G101

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 291 A, 1.2 KV, MODULE

Deep-Dive with AI

Search across all available documentation for this part.

Product thumbnail image
Discrete Semiconductor Products

BSM300D12P4G101

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 291 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM300D12P4G101
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C291 A
Drain to Source Voltage (Vdss)1.2 kV
Drain to Source Voltage (Vdss)1200 V
Input Capacitance (Ciss) (Max) @ Vds30000 pF
Mounting TypeChassis Mount
Operating Temperature175 °C
Package / CaseModule
Power - Max [Max]925 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)
Vgs(th) (Max) @ Id4.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1$ 623.51
NewarkEach 1$ 763.33

Description

General part information

BSM300D12P4G101 Series

BSM300D12P4G101 is a half bridge module consisting of SiC-UMOSFET, suitable for motor drive, inverter, converter, photovoltaics, wind power generation, induction heating equipment.

Documents

Technical documentation and resources

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

BSM300D12P4G101 Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Optimized heat sink assembly method for effective heat dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the ELV directive

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use PLECS Models

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET

Technical Article

Part Explanation

Application Note

What is a Thermal Model? (SiC Power Device)

Thermal Design

Evaluation Board User's Guide

User's Guide

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

How to Use Thermal Models

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Export Regulations

Export Information

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use PSIM Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article