Discrete Semiconductor Products

RFN5BM3SFHTL

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Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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Search across all available documentation for this part.

DocumentsTO252 TL Taping Spec Diode Flammability +32

Discrete Semiconductor Products

RFN5BM3SFHTL

Active

Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Deep-Dive with AI

DocumentsTO252 TL Taping Spec Diode Flammability +32

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RFN5BM3SFHTL

Current - Average Rectified (Io)	5 A
Current - Reverse Leakage @ Vr	10 µA
Grade	Automotive
Mounting Type	Surface Mount
Operating Temperature - Junction	150 °C
Package / Case	SC-63, DPAK (2 Leads + Tab), TO-252-3
Qualification	AEC-Q101
Reverse Recovery Time (trr)	30 ns
Speed	200 mA, 500 ns
Supplier Device Package	TO-252
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	350 V
Voltage - Forward (Vf) (Max) @ If	1.5 V

RFN5BM3SFH Series

Super Fast Recovery Diode (AEC-Q101 Qualified)

Part	Mounting Type	Package / Case	Reverse Recovery Time (trr)	Supplier Device Package	Current - Reverse Leakage @ Vr	Speed	Technology	Current - Average Rectified (Io)	Voltage - DC Reverse (Vr) (Max) [Max]	Voltage - Forward (Vf) (Max) @ If	Operating Temperature - Junction	Qualification	Grade
Rohm Semiconductor RFN5B6STL	Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3	50 ns	CPD	10 µA	200 mA 500 ns	Standard	5 A	600 V	1.55 V	150 °C
Rohm Semiconductor RFN5BM3SFHTL	Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3	30 ns	TO-252	10 µA	200 mA 500 ns	Standard	5 A	350 V	1.5 V	150 °C	AEC-Q101	Automotive
Rohm Semiconductor RFN5BGE2STL	Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3	25 ns	TO-252GE	10 µA	200 mA 500 ns	Standard	5 A	200 V	980 mV	150 ¯C
Rohm Semiconductor RFN5BGE6STL	Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3	50 ns	TO-252GE	10 µA	200 mA 500 ns	Standard	5 A	600 V	1.55 V	150 ¯C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.54
		10	$ 1.28
		100	$ 1.02
		500	$ 0.86
		1000	$ 0.73
	Digi-Reel®	1	$ 1.54
		10	$ 1.28
		100	$ 1.02
		500	$ 0.86
		1000	$ 0.73
	Tape & Reel (TR)	2500	$ 0.69
		5000	$ 0.67
		12500	$ 0.65
Newark	Each (Supplied on Cut Tape)	1	$ 1.59
		10	$ 1.23
		25	$ 1.13
		50	$ 1.05
		100	$ 0.96
		250	$ 0.87
		500	$ 0.77
		1000	$ 0.72

Description

General part information

RFN5BM3SFH Series

RFN5BM3SFH is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

TO252 TL Taping Spec

Datasheet

Diode Flammability

TO-252 Part Marking

AEC-Q101 Automotive Requirements

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

RFN5BM3SFHTL

Deep-Dive with AI

RFN5BM3SFHTL

Deep-Dive with AI

Technical Specifications

RFN5BM3SFH Series

Pricing

Description

RFN5BM3SFH Series

Documents

TO252 TL Taping Spec

Diode Flammability

TO-252 Part Marking

AEC-Q101 Automotive Requirements

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

How to Use LTspice&reg; Models: Tips for Improving Convergence

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Judgment Criteria of Thermal Evaluation

Measurement Method and Usage of Thermal Resistance RthJC

Part Explanation

Diode Types and Applications

List of Diode Package Thermal Resistance

Moisture Sensitivity Level - Diodes

About Export Regulations

PCB Layout Thermal Design Guide

Notes for Temperature Measurement Using Thermocouples

How to Create Symbols for PSpice Models

Impedance Characteristics of Bypass Capacitor

What Is Thermal Design

RFN5BM3SFH Data Sheet

Condition of Soldering / Land Pattern Reference

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Reliability Test Result

Power Loss and Thermal Design of Diodes

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Importance of Probe Calibration When Measuring Power: Deskew

Two-Resistor Model for Thermal Simulation

Method for Monitoring Switching Waveform

What is a Thermal Model? (Diode)

How to Select Rectifier Diodes

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Absolute Maximum Rating and Electrical Characteristics of Diodes

Package Dimensions

RFN5BM3SFH Series

How to Use LTspice® Models: Tips for Improving Convergence