
LMZ31710RVQR
Active2.95V TO 17V, 10A STEP-DOWN POWER MODULE WITH CURRENT SHARING IN 10X10X4.3MM QFN PACKAGE
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LMZ31710RVQR
Active2.95V TO 17V, 10A STEP-DOWN POWER MODULE WITH CURRENT SHARING IN 10X10X4.3MM QFN PACKAGE
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Technical Specifications
Parameters and characteristics for this part
| Specification | LMZ31710RVQR |
|---|---|
| Applications | ITE (Commercial) |
| Control Features | Active High, Enable |
| Current - Output (Max) [Max] | 10 A |
| Efficiency | 94 % |
| Features | OTP, UVLO, OCP |
| Mounting Type | Surface Mount |
| Number of Outputs | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 42-BQFN Module |
| Size / Dimension [x] | 10.2 mm |
| Size / Dimension [x] | 0.4 in |
| Size / Dimension [y] | 10.2 mm |
| Size / Dimension [y] | 0.4 in |
| Size / Dimension [z] | 4.4 mm |
| Size / Dimension [z] | 0.17 in |
| Supplier Device Package | 42-B3QFN (10x10) |
| Type | Non-Isolated PoL Module |
| Voltage - Input (Max) [Max] | 17 V |
| Voltage - Input (Min) [Min] | 2.95 V |
| Voltage - Output 1 [Max] | 5.5 V |
| Voltage - Output 1 [Min] | 0.6 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 15.43 | |
| 5 | $ 14.54 | |||
| 10 | $ 14.18 | |||
| 25 | $ 13.71 | |||
| 50 | $ 13.37 | |||
| 100 | $ 13.03 | |||
| 250 | $ 12.60 | |||
| Digi-Reel® | 1 | $ 15.43 | ||
| 5 | $ 14.54 | |||
| 10 | $ 14.18 | |||
| 25 | $ 13.71 | |||
| 50 | $ 13.37 | |||
| 100 | $ 13.03 | |||
| 250 | $ 12.60 | |||
| Tape & Reel (TR) | 500 | $ 12.28 | ||
| Texas Instruments | LARGE T&R | 1 | $ 14.47 | |
| 100 | $ 12.64 | |||
| 250 | $ 9.74 | |||
| 1000 | $ 8.72 | |||
Description
General part information
LMZ31710 Series
The LMZ31710 power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. The device achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
The LMZ31710 power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
Documents
Technical documentation and resources