LMZ31710 Series

2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package

Catalog

2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package

Part	Applications	Type	Package / Case	Number of Outputs	Control Features	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Input (Min) [Min]	Features	Efficiency	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [z]	Size / Dimension [x]	Size / Dimension [z]	Size / Dimension [x]	Voltage - Input (Max) [Max]	Mounting Type	Supplier Device Package	Current - Output (Max) [Max]	Voltage - Output 1 [Max]	Voltage - Output 1 [Min]
Texas Instruments LMZ31710RVQT	ITE (Commercial)	Non-Isolated PoL Module	42-BQFN Module	1	Active High Enable	85 °C	-40 °C	2.95 V	OCP OTP UVLO	94 %	10.2 mm	0.4 in	4.4 mm	10.2 mm	0.17 in	0.4 in	17 V	Surface Mount	42-B3QFN (10x10)	10 A	5.5 V	0.6 V
Texas Instruments LMZ31710RVQR	ITE (Commercial)	Non-Isolated PoL Module	42-BQFN Module	1	Active High Enable	85 °C	-40 °C	2.95 V	OCP OTP UVLO	94 %	10.2 mm	0.4 in	4.4 mm	10.2 mm	0.17 in	0.4 in	17 V	Surface Mount	42-B3QFN (10x10)	10 A	5.5 V	0.6 V

Catalog

2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package

Key Features

• Complete integrated power solutionSmall footprint, low-profile designPin compatible with LMZ31707 and LMZ3170410-mm × 10-mm × 4.3-mm packageEfficiencies up to 95%Eco-Mode™ and light load efficiency (LLE)Wide-output voltage adjust0.6 V to 5.5 V, With 1% reference accuracySupports parallel operation for higher currentOptional split power rail allowsinput voltage down to 2.95 VAdjustable switching frequency(200 kHz to 1.2 MHz)Synchronizes to an external clockProvides 180° out-of-phase clock signalAdjustable slow startOutput voltage sequencing and trackingPower-good outputProgrammable undervoltage lockout (UVLO)Overcurrent and overtemperature protectionPrebias output start-upOperating temperature range: –40°C to +85°CEnhanced thermal performance: 13.3°C/WMeets EN55022 Class B emissions- integrated shielded inductorCreate a custom design using the LMZ31710 with theWEBENCH® Power DesignerComplete integrated power solutionSmall footprint, low-profile designPin compatible with LMZ31707 and LMZ3170410-mm × 10-mm × 4.3-mm packageEfficiencies up to 95%Eco-Mode™ and light load efficiency (LLE)Wide-output voltage adjust0.6 V to 5.5 V, With 1% reference accuracySupports parallel operation for higher currentOptional split power rail allowsinput voltage down to 2.95 VAdjustable switching frequency(200 kHz to 1.2 MHz)Synchronizes to an external clockProvides 180° out-of-phase clock signalAdjustable slow startOutput voltage sequencing and trackingPower-good outputProgrammable undervoltage lockout (UVLO)Overcurrent and overtemperature protectionPrebias output start-upOperating temperature range: –40°C to +85°CEnhanced thermal performance: 13.3°C/WMeets EN55022 Class B emissions- integrated shielded inductorCreate a custom design using the LMZ31710 with theWEBENCH® Power Designer

Description

The LMZ31710 power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. The device achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques. The LMZ31710 power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. The device achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.