Connectors, Interconnects
H3165-05
ActiveHarwin Inc.
IC & COMPONENT SOCKET, 1 CONTACTS, PCB SOCKET, BERYLLIUM COPPER
Deep-Dive with AI
Search across all available documentation for this part.
Connectors, Interconnects
H3165-05
ActiveHarwin Inc.
IC & COMPONENT SOCKET, 1 CONTACTS, PCB SOCKET, BERYLLIUM COPPER
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | H3165-05 |
|---|---|
| Accepts Pin Diameter [Max] | 1.05 mm |
| Accepts Pin Diameter [Max] | 0.041 " |
| Accepts Pin Diameter [Min] | 0.89 mm |
| Accepts Pin Diameter [Min] | 0.035 " |
| Contact Finish | Gold |
| Contact Finish Thickness | 5.9 µin |
| Contact Finish Thickness | 0.15 µm |
| Contact Material | Beryllium Copper |
| Flange Diameter [diameter] | 2.67 mm |
| Flange Diameter [diameter] | 0.105 in |
| Insertion Force [Max] | 9 N |
| Insertion Force [Min] | 3 N |
| Length - Overall [x] | 0.222 in |
| Length - Overall [x] | 5.65 mm |
| Mounting Hole Diameter [Max] | 0.077 " |
| Mounting Hole Diameter [Max] | 1.96 mm |
| Mounting Hole Diameter [Min] | 1.91 mm |
| Mounting Hole Diameter [Min] | 0.075 " |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 C |
| Tail Type | No Tail |
| Termination | Knurled, Press-Fit |
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Insertion Force [Max] | Insertion Force [Min] | Contact Finish | Contact Material | Length - Overall [x] | Length - Overall [x] | Tail Type | Contact Finish Thickness | Contact Finish Thickness | Flange Diameter [diameter] | Flange Diameter [diameter] | Accepts Pin Diameter [Max] | Accepts Pin Diameter [Min] | Accepts Pin Diameter [Max] | Accepts Pin Diameter [Min] | Termination | Mounting Hole Diameter [Min] | Mounting Hole Diameter [Min] | Mounting Hole Diameter [Max] | Mounting Hole Diameter [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Harwin Inc. | -55 C | 125 °C | 9 N | 3 N | Gold | Beryllium Copper | 0.222 in | 5.65 mm | No Tail | 5.9 µin | 0.15 µm | 2.67 mm | 0.105 in | 1.05 mm | 0.89 mm | 0.041 " | 0.035 " | Knurled Press-Fit | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm |
 Harwin Inc. | -55 C | 125 °C | 9 N | 3 N | Gold | Beryllium Copper | 0.222 in | 5.65 mm | No Tail | 5.9 µin | 0.15 µm | 2.67 mm | 0.105 in | 1.05 mm | 0.89 mm | 0.041 " | 0.035 " | Knurled Press-Fit | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm |
 Harwin Inc. | -55 C | 125 °C | 9 N | 3 N | Tin | Beryllium Copper | 0.222 in | 5.65 mm | No Tail | 157.5 µin | 4 µm | 2.67 mm | 0.105 in | 1.05 mm | 0.89 mm | 0.041 " | 0.035 " | Knurled Press-Fit | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
H3165 Series
The H3165-05 is a PC Board Socket for mating Ø1mm pin, retention feature - gold clip tin shell. It has female/socket/jack contact gender, vertical orientation and PC tail/through-board mating pin size. It uses 4-finger beryllium copper contact clip (10-2000Hz vibration, 10G, 6 hours).
Documents
Technical documentation and resources