H3165 Series
Manufacturer: Harwin Inc.
Beta
⌘K
IC & COMPONENT SOCKET, 1 CONTACTS, PCB SOCKET, BERYLLIUM COPPER
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Insertion Force [Max] | Insertion Force [Min] | Contact Finish | Contact Material | Length - Overall [x] | Length - Overall [x] | Tail Type | Contact Finish Thickness | Contact Finish Thickness | Flange Diameter [diameter] | Flange Diameter [diameter] | Accepts Pin Diameter [Max] | Accepts Pin Diameter [Min] | Accepts Pin Diameter [Max] | Accepts Pin Diameter [Min] | Termination | Mounting Hole Diameter [Min] | Mounting Hole Diameter [Min] | Mounting Hole Diameter [Max] | Mounting Hole Diameter [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Harwin Inc. | -55 C | 125 °C | 9 N | 3 N | Gold | Beryllium Copper | 0.222 in | 5.65 mm | No Tail | 5.9 µin | 0.15 µm | 2.67 mm | 0.105 in | 1.05 mm | 0.89 mm | 0.041 " | 0.035 " | Knurled Press-Fit | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm |
 Harwin Inc. | -55 C | 125 °C | 9 N | 3 N | Gold | Beryllium Copper | 0.222 in | 5.65 mm | No Tail | 5.9 µin | 0.15 µm | 2.67 mm | 0.105 in | 1.05 mm | 0.89 mm | 0.041 " | 0.035 " | Knurled Press-Fit | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm |
 Harwin Inc. | -55 C | 125 °C | 9 N | 3 N | Tin | Beryllium Copper | 0.222 in | 5.65 mm | No Tail | 157.5 µin | 4 µm | 2.67 mm | 0.105 in | 1.05 mm | 0.89 mm | 0.041 " | 0.035 " | Knurled Press-Fit | 1.91 mm | 0.075 " | 0.077 " | 1.96 mm |