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VQFNP (RWG)
Integrated Circuits (ICs)

O31310QRWGRQ1

Active
Texas Instruments

HIGH-VOLTAGE PMIC FOR AUTOMOTIVE APPLICATIONS

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VQFNP (RWG)
Integrated Circuits (ICs)

O31310QRWGRQ1

Active
Texas Instruments

HIGH-VOLTAGE PMIC FOR AUTOMOTIVE APPLICATIONS

Technical Specifications

Parameters and characteristics for this part

SpecificationO31310QRWGRQ1
GradeAutomotive
Mounting TypeWettable Flank, Surface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case40-VFQFN Exposed Pad
QualificationAEC-Q100
Supplier Device Package40-VQFNP (6x6)
Voltage - Supply [Max]36 V
Voltage - Supply [Min]4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 7.91
10$ 7.14
25$ 6.81
100$ 5.91
250$ 5.65
500$ 5.15
1000$ 4.48
Digi-Reel® 1$ 7.91
10$ 7.14
25$ 6.81
100$ 5.91
250$ 5.65
500$ 5.15
1000$ 4.48
Tape & Reel (TR) 2000$ 4.32
Texas InstrumentsLARGE T&R 1$ 6.05
100$ 4.93
250$ 3.88
1000$ 3.29

Description

General part information

TPS65313-Q1 Series

The TPS65313-Q1 device is a power management IC (PMIC) that meets the requirements of MCU-controlled or DSP-controlled automotive, industrial, machinery, or transportation systems. With the integration of commonly used features, the device helps reduce board space and system cost.

The device includes one wide-VIN synchronous buck regulator (BUCK1) combined with one low-voltage (LV) buck regulator (BUCK2) and one boost converter (BOOST), which are powered from the wide-VIN buck regulator (BUCK1). The device features a low quiescent current in the OFF state to reduce current consumption in case the system is permanently connected to the supply. All outputs are protected against overvoltage, overload, and overtemperature conditions.

The TPS65313-Q1 device is a power management IC (PMIC) that meets the requirements of MCU-controlled or DSP-controlled automotive, industrial, machinery, or transportation systems. With the integration of commonly used features, the device helps reduce board space and system cost.