Connectors, Interconnects

2009891110

Active

SLIM-GRID HEADER, 10 CIRCUITS, SURFACE MOUNT, VERTICAL, SHROUDED, 0.38ΜM GOLD (AU) PLATED, WITH PICK-AND-PLACE CAP, TUBE, LEAD-FREE

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

Connectors, Interconnects

2009891110

Active

Molex

SLIM-GRID HEADER, 10 CIRCUITS, SURFACE MOUNT, VERTICAL, SHROUDED, 0.38ΜM GOLD (AU) PLATED, WITH PICK-AND-PLACE CAP, TUBE, LEAD-FREE

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	2009891110

Applications	General Purpose, Telecommunications, Automotive
Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	15 µin
Contact Finish Thickness - Mating	0.38 µm
Contact Finish Thickness - Post	2 çm
Contact Finish Thickness - Post	78.7 çin
Contact Material	Copper Alloy
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Latch Holder
Features	Pick and Place
Insulation Color	Black
Insulation Height	0.28 in
Insulation Height	7.1 mm
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	10
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Row Spacing - Mating	0.05 in
Row Spacing - Mating	1.27 mm
Shrouding	Shrouded - 4 Wall
Termination	Solder
Voltage Rating	125 VDC

200989 Series

Slim-Grid Header, 18 Circuits, Surface Mount, Vertical, Shrouded, 0.38µm Gold (Au) Plated, with Pick-and-Place Cap, Tube, Lead-Free

Part	Connector Type	Insulation Height	Insulation Height	Contact Finish - Mating	Mounting Type	Contact Type	Contact Finish - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Max]	Operating Temperature [Min]	Number of Rows	Insulation Color	Features	Applications	Number of Positions Loaded	Contact Shape	Fastening Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Number of Positions	Row Spacing - Mating	Row Spacing - Mating	Shrouding	Voltage Rating	Contact Material	Pitch - Mating	Pitch - Mating	Number of Positions
Molex 2009891106	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black	Pick and Place	Automotive General Purpose Telecommunications	All	Square	Latch Holder	15 µin	0.38 µm	UL94 V-0	6	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009891014	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black	Pick and Place	Automotive General Purpose Telecommunications	All	Square	Latch Holder	2 µin	0.051 µm	UL94 V-0	14	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009891206	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black	Pick and Place	Automotive General Purpose Telecommunications	All	Square	Latch Holder	30 Áin	0.76 Ám	UL94 V-0	6	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009891208	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black	Pick and Place	Automotive General Purpose Telecommunications	All	Square	Latch Holder	30 Áin	0.76 Ám	UL94 V-0	8	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009890014	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black		Automotive General Purpose Telecommunications	All	Square	Latch Holder	2 µin	0.051 µm	UL94 V-0	14	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009891112	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black	Pick and Place	Automotive General Purpose Telecommunications	All	Square	Latch Holder	15 µin	0.38 µm	UL94 V-0	12	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009890016	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black		Automotive General Purpose Telecommunications	All	Square	Latch Holder	2 µin	0.051 µm	UL94 V-0		0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm	16
Molex 2009890006	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black		Automotive General Purpose Telecommunications	All	Square	Latch Holder	2 µin	0.051 µm	UL94 V-0	6	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009890004	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black		Automotive General Purpose Telecommunications	All	Square	Latch Holder	2 µin	0.051 µm	UL94 V-0	4	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm
Molex 2009891110	Header	0.28 in	7.1 mm	Gold	Surface Mount	Male Pin	Tin	Solder	2 çm	78.7 çin	105 ░C	-55 °C	2	Black	Pick and Place	Automotive General Purpose Telecommunications	All	Square	Latch Holder	15 µin	0.38 µm	UL94 V-0	10	0.05 in	1.27 mm	Shrouded - 4 Wall	125 VDC	Copper Alloy	0.05 in	1.27 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

200989 Series

Slim-Grid Header, 18 Circuits, Surface Mount, Vertical, Shrouded, 0.38µm Gold (Au) Plated, with Pick-and-Place Cap, Tube, Lead-Free

Documents

Technical documentation and resources