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LPS27HHWTR
Sensors, Transducers

LPS27HHWTR

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STMicroelectronics

MEMS PRESSURE SENSOR: 260-1260 HPA ABSOLUTE DIGITAL OUTPUT BAROMETER WITH WATER RESISTANT PACKAGE

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Search across all available documentation for this part.

DocumentsAN5387+7
LPS27HHWTR
Sensors, Transducers

LPS27HHWTR

Active
STMicroelectronics

MEMS PRESSURE SENSOR: 260-1260 HPA ABSOLUTE DIGITAL OUTPUT BAROMETER WITH WATER RESISTANT PACKAGE

Deep-Dive with AI

DocumentsAN5387+7

Technical Specifications

Parameters and characteristics for this part

SpecificationLPS27HHWTR
Accuracy0.015 PSI
Accuracy0.1 kPa
ApplicationsBoard Mount
FeaturesTemperature Compensated
Maximum Pressure1000 kPa
Maximum Pressure [Max]145.04 PSI
Mounting TypeSurface Mount
Operating Pressure [Max]126 kPa
Operating Pressure [Max]18.27 PSI
Operating Pressure [Min]3.77 PSI
Operating Pressure [Min]26 kPa
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 C
Output24 b
Output TypeSPI, I2C
Package / Case10-CLGA
Port StyleNo Port
Termination StyleSMD (SMT) Tab
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1969$ 5.82
NewarkEach (Supplied on Cut Tape) 1$ 4.78
10$ 4.17
25$ 4.03
50$ 3.90
100$ 3.76
250$ 3.68
500$ 3.35
1000$ 3.27

Description

General part information

LPS27HHW Series

The LPS27HHW is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C, MIPI I3CSMor SPI from the sensing element to the application.

The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.

The LPS27HHW is available in a ceramic LGA package with metal lid. It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element. Gel inside the IC protects the electrical components from water and the metal cap is grounded electrically for better ESD robustness.