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Technical Specifications
Parameters and characteristics for this part
| Specification | A2F200M3F-1FGG484 |
|---|---|
| Architecture | MCU, FPGA |
| Connectivity | I2C, EBI/EMI, UART/USART, Ethernet, SPI |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 256 KB |
| Number of I/O [custom] | 94 |
| Number of I/O [custom] | 41 I/O |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | 0 °C |
| Package / Case | 484-BGA |
| Peripherals | POR, DMA, WDT |
| Primary Attributes | 4608 D-Flip-Flops, 200000 Gates |
| Primary Attributes | ProASIC®3 FPGA |
| RAM Size | 64 KB |
| Speed | 100 MHz |
| Supplier Device Package | 484-FPBGA (23x23) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
A2F200M3F Series
SmartFusion®
System on Chip (SoC) FPGAs are the only devices that integrate an FPGA
fabric, ARM Cortex-M3 Processor, and programmable analog circuitry, offering
Documents
Technical documentation and resources
No documents available