Fans, Blowers, Thermal Management

371824B00032G

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HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM

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Fans, Blowers, Thermal Management

Active

HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM

Technical Specifications

Parameters and characteristics for this part

Specification	371824B00032G

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	7 mm
Fin Height	0.275 in
Length	35 mm
Length [x]	1.378 "
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	BGA
Power Dissipation @ Temperature Rise	1.5 W, 50 °C
Shape	Pin Fins, Square
Thermal Resistance @ Forced Air Flow	9.7 °C/W
Thermal Resistance @ Natural	31.9 °C/W
Type	Top Mount
Width [y]	1.378 "
Width [y]	35 mm

Part	Package Cooled	Material Finish	Attachment Method	Shape	Width [y]	Width [y]	Material	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Fin Height	Fin Height	Type	Length [x]	Length	Thermal Resistance @ Natural
Boyd Laconia, LLC 371824B00032G	BGA	Black Anodized	Thermal Tape Adhesive (Included)	Pin Fins Square	1.378 "	35 mm	Aluminum	1.5 W 50 °C	9.7 °C/W	7 mm	0.275 in	Top Mount	1.378 "	35 mm	31.9 °C/W

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Arrow	N/A	64	$ 2.24
Digikey	N/A	272	$ 7.72
Newark	Each	1	$ 3.37