371824 Series
Manufacturer: Boyd Laconia, LLC
Beta
⌘K
HEAT SINK, SQUARE, PCB, FOR BALL GRID ARRAYS, 31.9 °C/W, BGA, 35 MM, 7.01 MM, 35 MM
| Part | Package Cooled | Material Finish | Attachment Method | Shape | Width [y] | Width [y] | Material | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Fin Height | Fin Height | Type | Length [x] | Length | Thermal Resistance @ Natural |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Boyd Laconia, LLC | BGA | Black Anodized | Thermal Tape Adhesive (Included) | Pin Fins Square | 1.378 " | 35 mm | Aluminum | 1.5 W 50 °C | 9.7 °C/W | 7 mm | 0.275 in | Top Mount | 1.378 " | 35 mm | 31.9 °C/W |