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B1QFN (RUQ)
Power Supplies - Board Mount

LMZ31506RUQR

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Texas Instruments

4.5V TO 15V, 6A STEP-DOWN POWER MODULE IN 9X15X2.8MM QFN PACKAGE

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B1QFN (RUQ)
Power Supplies - Board Mount

LMZ31506RUQR

Active
Texas Instruments

4.5V TO 15V, 6A STEP-DOWN POWER MODULE IN 9X15X2.8MM QFN PACKAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationLMZ31506RUQR
ApplicationsITE (Commercial)
Control FeaturesActive High, Enable
Current - Output (Max) [Max]6 A
Efficiency95 %
FeaturesOTP, UVLO, OCP
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case47-BQFN Exposed Pad
Size / Dimension [x]0.6 in
Size / Dimension [x]15.2 mm
Size / Dimension [y]0.36 "
Size / Dimension [y]9.2 mm
Size / Dimension [z]0.11 in
Size / Dimension [z]2.9 mm
TypeNon-Isolated PoL Module
Voltage - Input (Min) [Min]1.6 V
Voltage - Output 1 [Max]5.5 V
Voltage - Output 1 [Min]0.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 12.25
10$ 11.26
25$ 10.79
100$ 9.51
250$ 9.04
Digi-Reel® 1$ 12.25
10$ 11.26
25$ 10.79
100$ 9.51
250$ 9.04
Tape & Reel (TR) 500$ 8.46
1000$ 7.76
Texas InstrumentsLARGE T&R 1$ 9.59
100$ 8.38
250$ 6.46
1000$ 5.78

Description

General part information

LMZ31506H Series

The LMZ31506H power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The LMZ31506H offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.