Catalog
6A Power Module with 4.5V-14.5V Input in QFN package
Key Features
• Complete Integrated Power Solution AllowsSmall Footprint, Low-Profile Design9-mm × 15-mm × 2.8-mm packageEfficiencies Up To 96%Wide-Output Voltage Adjust1.2 V to 5.5 V, with 1% Reference AccuracyOptional Split Power Rail allowsInput Voltage Down to 1.7 VAdjustable Switching Frequency(480 kHz to 780 kHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing and TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionPre-bias Output Start-upOperating Temperature Range: –40°C to +85°CEnhanced Thermal Performance: 13°C/WMeets EN55022 Class B Emissions- Integrated Shielded InductorCreate a Custom Design Using the LMZ31506H With theWEBENCH®Power DesignerComplete Integrated Power Solution AllowsSmall Footprint, Low-Profile Design9-mm × 15-mm × 2.8-mm packageEfficiencies Up To 96%Wide-Output Voltage Adjust1.2 V to 5.5 V, with 1% Reference AccuracyOptional Split Power Rail allowsInput Voltage Down to 1.7 VAdjustable Switching Frequency(480 kHz to 780 kHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing and TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionPre-bias Output Start-upOperating Temperature Range: –40°C to +85°CEnhanced Thermal Performance: 13°C/WMeets EN55022 Class B Emissions- Integrated Shielded InductorCreate a Custom Design Using the LMZ31506H With theWEBENCH®Power Designer
Description
AI
The LMZ31506H power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.
The LMZ31506H offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
The LMZ31506H power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.
The LMZ31506H offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
