Specification	FDMA3027PZ-F130

Mounting Type	Surface Mount
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Package / Case	6-VDFN Exposed Pad
Power - Max [Max]	700 mW
Supplier Device Package	6-MicroFET (2x2)

FDMA3027PZ Series

Dual P-Channel PowerTrench® MOSFET -30V , -3.3A, 87mΩ

Part	Package / Case	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Power - Max [Max]	Supplier Device Package
ON Semiconductor FDMA3027PZ-F130	6-VDFN Exposed Pad	-55 °C	150 °C	Surface Mount	700 mW	6-MicroFET (2x2)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	479	$ 0.63
LCSC	Piece	1	$ 1.71
		200	$ 0.66
		500	$ 0.64
		1000	$ 0.63

Description

General part information

FDMA3027PZ Series

This device is designed specifically as a single package solution for dual switching requirements such as gate driver for larger Mosfets. It features two independent P-Channel MOSFETs with low on-state resistance for minimum conduction losses. The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to linear mode applications. G-S zener has been added to enhance ESD voltage level.