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20 WLP
Integrated Circuits (ICs)

MAX77813EWP33+T

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Analog Devices Inc./Maxim Integrated

5.5V INPUT, 2A, HIGH-EFFICIENCY BUCK-BOOST CONVERTER

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20 WLP
Integrated Circuits (ICs)

MAX77813EWP33+T

Active
Analog Devices Inc./Maxim Integrated

5.5V INPUT, 2A, HIGH-EFFICIENCY BUCK-BOOST CONVERTER

Technical Specifications

Parameters and characteristics for this part

SpecificationMAX77813EWP33+T
Current - Output2 A
Frequency - Switching2.5 MHz
FunctionStep-Down, Step-Up/Step-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Output ConfigurationPositive
Output TypeProgrammable
Package / CaseWLBGA, 20-WFBGA
Supplier Device Package20-WLP
Supplier Device Package [x]1.83
Supplier Device Package [y]2.13
Synchronous RectifierFalse
TopologyBuck-Boost
Voltage - Input (Max) [Max]5.5 V
Voltage - Input (Min) [Min]2.3 V
Voltage - Output (Max) [Max]5.14 V
Voltage - Output (Min/Fixed) [Min]2.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 1.62
Tape & Reel (TR) 2500$ 1.62
5000$ 1.59

Description

General part information

MAX77813 Series

The MAX77813 is a high-efficiency step-up/step-down (buck-boost) converter targeted for single-cell Li+/Li-ion battery powered applications. The device maintains a regulated output voltage from 2.6V to 5.14V across an input voltage range of 2.3V to 5.5V. The device supports up to 2A of output current in boost mode and up to 3A in buck mode.The device seamlessly transitions between buck and boost modes. A unique control algorithm allows high-efficiency, outstanding load, and line transient response.Dedicated enable and power-OK pins allow simple hardware control. An I2C serial interface is optionally used for dynamic voltage scaling, system power optimization, and fault read-back. The device supports two inductor switching current limit options selected by the ILIM pin.The MAX77813 is available in a 20-bump, 2.13mm x 1.83mm wafer-level package (WLP).APPLICATIONSSingle-Cell Li-ion Powered ApplicationsHandheld Scanners, Mobile Payment Terminals, Security CamerasAR/VR Headsets