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TO-220-2 (TO-220NFM)
Discrete Semiconductor Products

RF1501TF3SFHC9

Active
Rohm Semiconductor

RECTIFIER, AEC-Q101, 20A, 350V, TO-220NFM ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsHow to Use LTspice® Models: Tips for Improving ConvergencePart Explanation+31
TO-220-2 (TO-220NFM)
Discrete Semiconductor Products

RF1501TF3SFHC9

Active
Rohm Semiconductor

RECTIFIER, AEC-Q101, 20A, 350V, TO-220NFM ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsHow to Use LTspice® Models: Tips for Improving ConvergencePart Explanation+31

Technical Specifications

Parameters and characteristics for this part

SpecificationRF1501TF3SFHC9
Current - Reverse Leakage @ Vr10 µA
GradeAutomotive
Mounting TypeThrough Hole
Operating Temperature - Junction150 °C
Package / CaseTO-220-2 Full Pack
QualificationAEC-Q101
Reverse Recovery Time (trr)30 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-220NFM
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]300 V
Voltage - Forward (Vf) (Max) @ If1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 1.81
50$ 1.46
100$ 1.20
500$ 1.01
1000$ 0.86
2000$ 0.82
5000$ 0.79
10000$ 0.76
NewarkEach 1$ 2.31
10$ 1.81
100$ 1.21
500$ 0.97
1000$ 0.89
2500$ 0.83
5000$ 0.79

Description

General part information

RF1501TF3SFH Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

RF1501TF3SFH Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Package Dimensions

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Reliability Test Result

Manufacturing Data

How to Select Rectifier Diodes

Technical Article

ESD Data

Characteristics Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Diode Types and Applications

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Explanation for Marking

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Export Regulations

Export Information

Taping Information

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design