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Discrete Semiconductor Products

RF1501TF3SC9

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Rohm Semiconductor

DIODE GEN PURP 350V 20A TO220NFM

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Discrete Semiconductor Products

RF1501TF3SC9

Active
Rohm Semiconductor

DIODE GEN PURP 350V 20A TO220NFM

Technical Specifications

Parameters and characteristics for this part

SpecificationRF1501TF3SC9
Current - Reverse Leakage @ Vr10 µA
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-2 Full Pack
Reverse Recovery Time (trr)30 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-220NFM
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]350 V
Voltage - Forward (Vf) (Max) @ If1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 0.95
50$ 0.77
100$ 0.61
500$ 0.52
1000$ 0.51

Description

General part information

RF1501TF3SFH Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

Diode Types and Applications

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Explanation for Marking

Package Information

RF1501TF3S Data Sheet

Data Sheet

Taping Information

Package Information

About Flammability of Materials

Environmental Data

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Rectifier Diodes

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

ESD Data

Characteristics Data

What is a Thermal Model? (Diode)

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Part Explanation

Application Note

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information