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Discrete Semiconductor Products

RXL035N03TCR

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Rohm Semiconductor

NCH 30V 3..5A SMALL SIGNAL MOSFET

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Product dimension image
Discrete Semiconductor Products

RXL035N03TCR

Active
Rohm Semiconductor

NCH 30V 3..5A SMALL SIGNAL MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRXL035N03TCR
Current - Continuous Drain (Id) @ 25°C3.5 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs3.3 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]180 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power Dissipation (Max)910 mW
Rds On (Max) @ Id, Vgs50 mOhm
Supplier Device PackageTUMT6
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.82
10$ 0.52
100$ 0.34
500$ 0.26
1000$ 0.25
Digi-Reel® 1$ 0.82
10$ 0.52
100$ 0.34
500$ 0.26
1000$ 0.25
N/A 2900$ 0.78
Tape & Reel (TR) 3000$ 0.25

Description

General part information

RXL035 Series

RXL035N03 is low on-resistance and small surface mount package MOSFET for switching application.

Documents

Technical documentation and resources

Package Dimensions

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

Reliability Test Result

Manufacturing Data

Constitution Materials List

Environmental Data

RXL035N03 Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Compliance of the RoHS directive

Environmental Data

Taping Information

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

RXL035N03 ESD Data

Characteristics Data

Inner Structure

Package Information

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Create Symbols for PSpice Models

Models

What is a Thermal Model? (Transistor)

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data