Integrated Circuits (ICs)

MCP2003T-E/SN

LTB

Microchip Technology

LIN TRANSCEIVER 20KBD 8-PIN SOIC N T/R

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsMCP2003 Technical Brief Datasheet

Integrated Circuits (ICs)

MCP2003T-E/SN

LTB

Microchip Technology

LIN TRANSCEIVER 20KBD 8-PIN SOIC N T/R

Deep-Dive with AI

DocumentsMCP2003 Technical Brief Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	MCP2003T-E/SN

Duplex	Half
Mounting Type	Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	8-SOIC
Package / Case [x]	0.154 in
Package / Case [y]	3.9 mm
Protocol	LINbus
Receiver Hysteresis	175 mV
Supplier Device Package	8-SOIC
Type	Transceiver
Voltage - Supply [Max]	27 V
Voltage - Supply [Min]	6 V

MCP2003B Series

LIN Transceiver

Part	Mounting Type	Duplex	Data Rate	Type	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Supplier Device Package	Voltage - Supply [Min]	Voltage - Supply [Max]	Protocol	Receiver Hysteresis	Package / Case	Package / Case	Package / Case [y]	Package / Case [x]
Microchip Technology MCP2003B-E/MC	Surface Mount	Half	20 kBd	Transceiver	125 °C	-40 °C	8-VFDFN Exposed Pad	8-DFN (2x3)	5.5 V	30 VDC	LINbus
Microchip Technology MCP2003A-E/P	Through Hole	Half		Transceiver	125 °C	-40 °C	8-DIP	8-PDIP	6 V	27 V	LINbus	175 mV	0.3 in	7.62 mm
Microchip Technology MCP2003B-E/MF	Surface Mount	Half	20 kBd	Transceiver	125 °C	-40 °C	8-VDFN Exposed Pad	8-DFN (3x3)	5.5 V	30 VDC	LINbus
Microchip Technology MCP2003B-E/SN	Surface Mount	Half	20 kBd	Transceiver	125 °C	-40 °C	8-SOIC	8-SOIC	5.5 V	30 VDC	LINbus				3.9 mm	0.154 in
Microchip Technology MCP2003BT-E/SN	Surface Mount	Half	20 kBd	Transceiver	125 °C	-40 °C	8-SOIC	8-SOIC	5.5 V	30 VDC	LINbus				3.9 mm	0.154 in
Microchip Technology MCP2003-E/MD	Surface Mount	Half		Transceiver	125 °C	-40 °C	8-VDFN Exposed Pad	8-DFN (4x4)	6 V	27 V	LINbus	175 mV
Microchip Technology MCP2003A-E/MD	Surface Mount	Half		Transceiver	125 °C	-40 °C	8-VDFN Exposed Pad	8-DFN (4x4)	6 V	27 V	LINbus	175 mV
Microchip Technology MCP2003T-E/SN	Surface Mount	Half		Transceiver	125 °C	-40 °C	8-SOIC	8-SOIC	6 V	27 V	LINbus	175 mV			3.9 mm	0.154 in
Microchip Technology MCP2003B-H/MC	Surface Mount	Half	20 kBd	Transceiver	125 °C	-40 °C	8-VFDFN Exposed Pad	8-DFN (2x3)	5.5 V	30 VDC	LINbus
Microchip Technology MCP2003BT-H/MF	Surface Mount	Half	20 kBd	Transceiver			8-VDFN Exposed Pad	8-DFN (3x3)	5.5 V	30 VDC	LINbus

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Arrow	N/A	1	$ 1.09
		10	$ 0.92
		50	$ 0.88
		100	$ 0.82
		200	$ 0.80
Digikey	Cut Tape (CT)	1	$ 1.17
		25	$ 0.98
		100	$ 0.90
	Digi-Reel®	1	$ 1.17
		25	$ 0.98
		100	$ 0.90
	Tape & Reel (TR)	3300	$ 0.90

Description

General part information

MCP2003B Series

Stand-alone LIN Transceiver -- MCP2003B supports a wide range of packages; 8-pin 2x3 DFN, 3x3 DFN and SOIC

This device provides a bidirectional, half-duplex communication, physical interface to automotive and industrial LIN systems to meet the LIN Bus Specification Revision 2.2, SAE J2602, and ISO 17987. The device is both short-circuit and overtemperature protected by internal circuitry. The device has been specifically designed to operate in the automotive operating environment and will survive all specified transient conditions while meeting all of the stringent quiescent current requirements.

Please see our MikroElektronika click board! <http://www.mikroe.com/click/mcp2003b>

Documents

Technical documentation and resources

MCP2003 Technical Brief

Datasheet