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Discrete Semiconductor Products

R6006KND4TL1

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Rohm Semiconductor

600V 2.8A SOT-223-3, HIGH-SPEED SWITCHING POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

R6006KND4TL1

Active
Rohm Semiconductor

600V 2.8A SOT-223-3, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6006KND4TL1
Current - Continuous Drain (Id) @ 25°C2.8 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]12 nC
Input Capacitance (Ciss) (Max) @ Vds350 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-261-3
Power Dissipation (Max)12.3 W
Rds On (Max) @ Id, Vgs870 mOhm
Supplier Device PackageSOT-223-3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3961$ 1.43
NewarkEach (Supplied on Cut Tape) 1$ 1.40
10$ 0.89
25$ 0.80
50$ 0.70
100$ 0.61
250$ 0.58
500$ 0.55
1000$ 0.50

Description

General part information

R6006KND4 Series

R6006KND4 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

What is a Thermal Model? (Transistor)

Thermal Design

About Export Regulations

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Super Junction MOSFET in the SOT-223-3 Package

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Types and Features of Transistors

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

R6006KND4 Data Sheet

Data Sheet

Anti-Whisker formation - Transistors

Package Information