Connectors, Interconnects

633-M62-363-BT2

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EDAC Inc.

D-SUB HIGH DENSITY CONNECTORS HIGH DENSITY D-SUB CONNECTORS

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Documents633-M62-363-BT2 | Datasheet

Connectors, Interconnects

633-M62-363-BT2

Active

EDAC Inc.

D-SUB HIGH DENSITY CONNECTORS HIGH DENSITY D-SUB CONNECTORS

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Documents633-M62-363-BT2 | Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	633-M62-363-BT2

Backset Spacing	8.89 mm
Backset Spacing	0.35 in
Connector Style	D-Sub, High Density
Connector Type	Plug, Male Pins
Contact Finish	Gold
Contact Finish Thickness	0.38 µm
Contact Finish Thickness	15 µin
Contact Type	Signal
Current Rating (Amps)	5 A
Features	Shielded, Grounding Indents
Flange Feature	Housing/Shell
Flange Feature	4-40
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle, Board Edge
Number of Positions	62
Number of Rows [custom]	3
Shell Size, Connector Layout	C, DC
Shell Size, Connector Layout	4
Termination	Solder

633M Series

Part	Features	Material Flammability Rating	Contact Finish Thickness	Contact Finish Thickness	Number of Rows [custom]	Shell Material, Finish	Mounting Type	Contact Finish	Shell Size, Connector Layout [custom]	Shell Size, Connector Layout [custom]	Termination	Connector Style	Current Rating (Amps)	Contact Type	Flange Feature	Number of Positions	Connector Type	Backset Spacing	Backset Spacing	Shell Size, Connector Layout	Contact Finish Thickness	Flange Feature	Shell Size, Connector Layout
EDAC Inc. 633-M15-663-WN1	Grounding Indents Shielded	UL94 V-0	30 Áin	0.76 Ám	3	Nickel Plated Steel	Board Edge Right Angle Through Hole	Gold	(DE E) High Density	1	Solder	D-Sub High Density	5 A	Signal	Housing/Shell (Unthreaded)	15	Plug Male Pins	8.89 mm	0.35 in
EDAC Inc. 633-M15-663-BT5	Grounding Indents Shielded	UL94 V-0	30 Áin	0.76 Ám	3		Board Edge Right Angle Through Hole	Gold	(DE E) High Density	1	Solder	D-Sub High Density	5 A	Signal	4-40	15	Plug Male Pins	8.89 mm	0.35 in
EDAC Inc. 633-M44-363-BT5	Grounding Indents Shielded	UL94 V-0	15 µin	0.38 µm	3		Board Edge Right Angle Through Hole	Gold			Solder	D-Sub High Density	5 A	Signal	4-40	44	Plug Male Pins	8.89 mm	0.35 in	3
EDAC Inc. 633-M15-263-WT6	Grounding Indents Shielded	UL94 V-0			3		Board Edge Right Angle Through Hole	Gold	(DE E) High Density	1	Solder	D-Sub High Density	5 A	Signal	Board Side (4-40)	15	Plug Male Pins	8.89 mm	0.35 in		Flash
EDAC Inc. 633-M15-263-WT2	Grounding Indents Shielded	UL94 V-0			3		Board Edge Right Angle Through Hole	Gold	(DE E) High Density	1	Solder	D-Sub High Density	5 A	Signal	Housing/Shell	15	Plug Male Pins	8.89 mm	0.35 in		Flash	4-40
EDAC Inc. 633-M44-663-BT4	Grounding Indents Shielded	UL94 V-0	30 Áin	0.76 Ám	3		Board Edge Right Angle Through Hole	Gold			Solder	D-Sub High Density	5 A	Signal	Housing/Shell	44	Plug Male Pins	8.89 mm	0.35 in	3		4-40
EDAC Inc. 633-M15-363-WN4	Grounding Indents Shielded	UL94 V-0	15 µin	0.38 µm	3	Nickel Plated Steel	Board Edge Right Angle Through Hole	Gold	(DE E) High Density	1	Solder	D-Sub High Density	5 A	Signal	Housing/Shell	15	Plug Male Pins	8.89 mm	0.35 in			4-40
EDAC Inc. 633-M62-363-BT2	Grounding Indents Shielded	UL94 V-0	15 µin	0.38 µm	3		Board Edge Right Angle Through Hole	Gold			Solder	D-Sub High Density	5 A	Signal	Housing/Shell	62	Plug Male Pins	8.89 mm	0.35 in	4		4-40	C DC
EDAC Inc. 633-M15-263-WT5	Grounding Indents Shielded	UL94 V-0			3		Board Edge Right Angle Through Hole	Gold	(DE E) High Density	1	Solder	D-Sub High Density	5 A	Signal	4-40	15	Plug Male Pins	8.89 mm	0.35 in		Flash
EDAC Inc. 633-M15-363-BN1	Grounding Indents Shielded	UL94 V-0	15 µin	0.38 µm	3	Nickel Plated Steel	Board Edge Right Angle Through Hole	Gold	(DE E) High Density	1	Solder	D-Sub High Density	5 A	Signal	Housing/Shell (Unthreaded)	15	Plug Male Pins	8.89 mm	0.35 in