633M Series
Manufacturer: EDAC Inc.
Beta
⌘K
D-SUB HIGH DENSITY CONNECTORS HIGH DENSITY D-SUB CONNECTORS
| Part | Features | Material Flammability Rating | Contact Finish Thickness | Contact Finish Thickness | Number of Rows [custom] | Shell Material, Finish | Mounting Type | Contact Finish | Shell Size, Connector Layout [custom] | Shell Size, Connector Layout [custom] | Termination | Connector Style | Current Rating (Amps) | Contact Type | Flange Feature | Number of Positions | Connector Type | Backset Spacing | Backset Spacing | Shell Size, Connector Layout | Contact Finish Thickness | Flange Feature | Shell Size, Connector Layout |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 30 Áin | 0.76 Ám | 3 | Nickel Plated Steel | Board Edge Right Angle Through Hole | Gold | (DE E) High Density | 1 | Solder | D-Sub High Density | 5 A | Signal | Housing/Shell (Unthreaded) | 15 | Plug Male Pins | 8.89 mm | 0.35 in | ||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 30 Áin | 0.76 Ám | 3 | Board Edge Right Angle Through Hole | Gold | (DE E) High Density | 1 | Solder | D-Sub High Density | 5 A | Signal | 4-40 | 15 | Plug Male Pins | 8.89 mm | 0.35 in | |||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 15 µin | 0.38 µm | 3 | Board Edge Right Angle Through Hole | Gold | Solder | D-Sub High Density | 5 A | Signal | 4-40 | 44 | Plug Male Pins | 8.89 mm | 0.35 in | 3 | ||||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 3 | Board Edge Right Angle Through Hole | Gold | (DE E) High Density | 1 | Solder | D-Sub High Density | 5 A | Signal | Board Side (4-40) | 15 | Plug Male Pins | 8.89 mm | 0.35 in | Flash | ||||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 3 | Board Edge Right Angle Through Hole | Gold | (DE E) High Density | 1 | Solder | D-Sub High Density | 5 A | Signal | Housing/Shell | 15 | Plug Male Pins | 8.89 mm | 0.35 in | Flash | 4-40 | |||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 30 Áin | 0.76 Ám | 3 | Board Edge Right Angle Through Hole | Gold | Solder | D-Sub High Density | 5 A | Signal | Housing/Shell | 44 | Plug Male Pins | 8.89 mm | 0.35 in | 3 | 4-40 | |||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 15 µin | 0.38 µm | 3 | Nickel Plated Steel | Board Edge Right Angle Through Hole | Gold | (DE E) High Density | 1 | Solder | D-Sub High Density | 5 A | Signal | Housing/Shell | 15 | Plug Male Pins | 8.89 mm | 0.35 in | 4-40 | |||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 15 µin | 0.38 µm | 3 | Board Edge Right Angle Through Hole | Gold | Solder | D-Sub High Density | 5 A | Signal | Housing/Shell | 62 | Plug Male Pins | 8.89 mm | 0.35 in | 4 | 4-40 | C DC | ||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 3 | Board Edge Right Angle Through Hole | Gold | (DE E) High Density | 1 | Solder | D-Sub High Density | 5 A | Signal | 4-40 | 15 | Plug Male Pins | 8.89 mm | 0.35 in | Flash | ||||||
 EDAC Inc. | Grounding Indents Shielded | UL94 V-0 | 15 µin | 0.38 µm | 3 | Nickel Plated Steel | Board Edge Right Angle Through Hole | Gold | (DE E) High Density | 1 | Solder | D-Sub High Density | 5 A | Signal | Housing/Shell (Unthreaded) | 15 | Plug Male Pins | 8.89 mm | 0.35 in |