Specification	14-350000-10-HT

Board Material	Polyimide (PI)
Board Thickness	1.57 mm
Board Thickness	0.062 "
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End)	7.62 mm
Convert To (Adapter End)	DIP
Convert To (Adapter End)	0.3 in
Material	FR4 Epoxy Glass
Mounting Type	Through Hole
Number of Pins	14
Number of Positions	14
Package Accepted	SOIC
Pitch	0.05 in
Pitch	1.27 mm
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Proto Board Type	DIP to DIP
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm

14-3500 Series

Part	Number of Pins	Termination	Contact Material - Post [custom]	Convert From (Adapter End)	Contact Finish - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Mounting Type	Board Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Board Thickness	Board Thickness	Package Accepted	Number of Positions	Proto Board Type	Material	Pitch	Pitch	Board Thickness	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]
Aries Electronics 14-350000-10-HT	14	Solder	Brass	SOIC	Tin-Lead	7.62 mm	DIP	0.3 in	Through Hole	Polyimide (PI)	200 µin	5.08 µm	1.27 mm	0.05 in	0.1 in	2.54 mm	0.125 in	3.18 mm	1.57 mm	0.062 "	SOIC	14	DIP to DIP	FR4 Epoxy Glass	0.05 in	1.27 mm
Aries Electronics 14-350000-10-P																			1.57 mm	0.062 "	SOIC	14	SMD to DIP	FR4 Epoxy Glass	0.05 in	1.27 mm	0.0625 in	35.56 mm	1.4 in	0.45 in	11.43 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly