Integrated Circuits (ICs)

APA1000-FGG896

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ULTRA LOW DENSITY FPGAS

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Integrated Circuits (ICs)

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ULTRA LOW DENSITY FPGAS

Technical Specifications

Parameters and characteristics for this part

Ultra Low Density FPGAs

Part	Mounting Type	Total RAM Bits	Package / Case	Operating Temperature [Min]	Operating Temperature [Max]	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of I/O	Number of Gates	Supplier Device Package
Microchip Technology APA1000-BG456M	Surface Mount	202752 bits	456-BBGA	-55 °C	125 °C	2.7 V	2.3 V	356	1000000
Microchip Technology APA1000-PQG208M	Surface Mount	202752 bits	208-BFQFP	-55 °C	125 °C	2.7 V	2.3 V	158	1000000	208-PQFP (28x28)
Microchip Technology APA1000-BGG456M	Surface Mount	202752 bits	456-BBGA	-55 °C	125 °C	2.7 V	2.3 V	356	1000000
Microchip Technology APA1000-CQ208M	Surface Mount	202752 bits	208-BFCQFP with Tie Bar	-55 °C	125 °C	2.7 V	2.3 V	158	1000000	208-CQFP (75x75)
Microchip Technology APA1000-CGS624B	Through Hole	202752 bits	624-BCCGA	-55 °C	125 ¯C	2.7 V	2.3 V	440 I/O	1000000	624-CCGA (32.5x32.5)
Microchip Technology APA1000-BG456	Surface Mount	202752 bits	456-BBGA	0 °C	70 °C	2.7 V	2.3 V	356	1000000
Microchip Technology APA1000-FGG896	Surface Mount	202752 bits	896-BGA	0 °C	70 °C	2.7 V	2.3 V	642	1000000	896-FBGA (31x31)
Microchip Technology APA1000-PQ208	Surface Mount	202752 bits	208-BFQFP	0 °C	70 °C	2.7 V	2.3 V	158	1000000	208-PQFP (28x28)
Microchip Technology APA1000-CGS624M	Through Hole	202752 bits	624-BCCGA	-55 °C	125 °C	2.7 V	2.3 V	440 I/O	1000000	624-CCGA (32.5x32.5)
Microchip Technology APA1000-FG896	Surface Mount	202752 bits	896-BGA	0 °C	70 °C	2.7 V	2.3 V	642	1000000	896-FBGA (31x31)

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General part information

The

ProASICPLUS family of devices, combines the advantages of ASICs with the

benefits of programmable devices through nonvolatile flash technology.

Technical documentation and resources

No documents available