1706721170

Obsolete

CONN EDGE DUAL FML 170POS 0.031

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Connectors, Interconnects

Obsolete

CONN EDGE DUAL FML 170POS 0.031

Technical Specifications

Parameters and characteristics for this part

Specification	1706721170

Card Thickness	0.093 in
Card Thickness	2.36 mm
Card Type	Non Specified - Dual Edge
Color	Black
Contact Finish	Gold
Contact Finish Thickness	0.76 Ám
Contact Finish Thickness	30 Áin
Contact Material	Copper Alloy
Gender	Female
Material - Insulation	Thermoplastic, Glass Filled
Mounting Type	Through Hole
Number of Positions	170
Number of Positions/Bay/Row [custom]	85
Number of Rows	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 °C
Pitch [x]	0.8 mm
Pitch [x]	0.031 in
Read Out	Dual
Termination	Press-Fit

EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 1 Bay, 200 Circuits

Part	Contact Material	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions/Bay/Row [custom]	Card Thickness	Card Thickness	Gender	Card Type	Material - Insulation	Pitch [x]	Pitch [x]	Read Out	Contact Finish Thickness	Contact Finish Thickness	Number of Rows	Mounting Type	Contact Finish	Color	Number of Positions
Molex 1706721170	Copper Alloy	Press-Fit	-40 °C	105 ░C	85	0.093 in	2.36 mm	Female	Non Specified - Dual Edge	Thermoplastic Glass Filled	0.8 mm	0.031 in	Dual	0.76 Ám	30 Áin	2	Through Hole	Gold	Black	170
Molex 1706721200	Copper Alloy	Press-Fit	-40 °C	105 ░C	100	0.093 in	2.36 mm	Female	Non Specified - Dual Edge	Thermoplastic Glass Filled	0.8 mm	0.031 in	Dual	0.76 Ám	30 Áin	2	Through Hole	Gold	Black

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 1 Bay, 200 Circuits

Technical documentation and resources

No documents available