170672 Series
EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 1 Bay, 200 Circuits
Manufacturer: Molex
Catalog
EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 1 Bay, 200 Circuits
Beta
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EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 1 Bay, 200 Circuits
EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 1 Bay, 200 Circuits
EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 1 Bay, 200 Circuits
| Part | Contact Material | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions/Bay/Row [custom] | Card Thickness | Card Thickness | Gender | Card Type | Material - Insulation | Pitch [x] | Pitch [x] | Read Out | Contact Finish Thickness | Contact Finish Thickness | Number of Rows | Mounting Type | Contact Finish | Color | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | Copper Alloy | Press-Fit | -40 °C | 105 ░C | 85 | 0.093 in | 2.36 mm | Female | Non Specified - Dual Edge | Thermoplastic Glass Filled | 0.8 mm | 0.031 in | Dual | 0.76 Ám | 30 Áin | 2 | Through Hole | Gold | Black | 170 |
 Molex | Copper Alloy | Press-Fit | -40 °C | 105 ░C | 100 | 0.093 in | 2.36 mm | Female | Non Specified - Dual Edge | Thermoplastic Glass Filled | 0.8 mm | 0.031 in | Dual | 0.76 Ám | 30 Áin | 2 | Through Hole | Gold | Black |