
TDA3MDDBABFQ1
ActiveLOW POWER SOC W/ FULL-FEATURED PROCESSING FOR ADAS APPLICATIONS
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TDA3MDDBABFQ1
ActiveLOW POWER SOC W/ FULL-FEATURED PROCESSING FOR ADAS APPLICATIONS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | TDA3MDDBABFQ1 |
|---|---|
| Architecture | MPU, DSP |
| Connectivity | I2C, McASP, MMC/SD/SDIO, UART, SPI, CANbus, USB, Ethernet |
| Core Processor | ARM® Cortex®-M4, C66x |
| Number of I/O | 126 |
| Operating Temperature [Max] | 125 ¯C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 367-BFBGA, FCBGA |
| Peripherals | WDT, DMA, PWM, POR |
| RAM Size | 512 kB |
| Speed | 500 MHz |
| Speed | 212.8 MHz |
| Supplier Device Package | 367-FCBGA (15x15) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
TDA3MD Series
TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.
The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.
The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.
Documents
Technical documentation and resources