TDA3MD Series

Low power SoC w/ full-featured processing for ADAS applications

Catalog

Low power SoC w/ full-featured processing for ADAS applications

Part	Core Processor	RAM Size	Peripherals	Speed	Speed	Supplier Device Package	Operating Temperature [Min]	Operating Temperature [Max]	Architecture	Number of I/O	Package / Case	Connectivity
Texas Instruments TDA3MDDBABFQ1	ARM® Cortex®-M4 C66x	512 kB	DMA POR PWM WDT	500 MHz	212.8 MHz	367-FCBGA (15x15)	-40 °C	125 ¯C	DSP MPU	126	367-BFBGA FCBGA	CANbus Ethernet I2C McASP MMC/SD/SDIO SPI UART USB

Catalog

Low power SoC w/ full-featured processing for ADAS applications

Key Features

• Architecture designed for ADAS applicationsVideo and image processing supportFull-HD video (1920 × 1080p, 60 fps)Video input and video outputUp to 2 C66x floating-point VLIW DSPFully object-code compatible with C67x and C64x+Up to thirty-two 16 × 16-bit fixed-point multiplies per cycleUp to 512kB of on-chip L3 RAMLevel 3 (L3) and Level 4 (L4) interconnectsMemory Interface (EMIF) moduleSupports DDR3/DDR3L up to DDR-1066Supports DDR2 up to DDR-800Supports LPDDR2 up to DDR-667Up to 2GB supportedDual Arm®Cortex®-M4 Image Processor Unit (IPU)Vision accelerationPacEmbedded Vision Engine (EVE)Display subsystemDisplay controller with DMA engineCVIDEO / SD-DAC TV analog composite outputVideo Input Port (VIP) moduleSupport for up to 4 multiplexed input portsOn-chip temperature sensor that is capable of generating temperature alertsGeneral-Purpose Memory Controller (GPMC)Enhanced Direct Memory Access (EDMA) controller3-port (2 external) Gigabit Ethernet (GMAC) switchController Area Network (DCAN) moduleCAN 2.0B protocolModular Controller Area Network (MCAN) moduleCAN 2.0B protocolEight 32-bit general-purpose timersThree configurable UART modulesFour Multichannel Serial Peripheral Interfaces (McSPI)Quad SPI interfaceTwo Inter-Integrated Circuit (I2C™) portsThree Multichannel Audio Serial Port (McASP) modulesSecure Digital Input Output Interface (SDIO)Up to 126 General-Purpose I/O (GPIO) pinsPower, reset, and clock managementOn-chip debug with CTools technologyAutomotive AEC-Q100 qualified15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)Seven Dual Clock Comparators (DCC)Memory Cyclic Redundancy Check (CRC)TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memoryError Signaling Module (ESM)Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers8-channel 10-bit ADCMIPI®Camera Serial Interface 2 (CSI-2)PWMSSFull HW image pipe: DPC, CFA, 3D-NF, RGB-YUVWDR, HW LDC and perspectiveArchitecture designed for ADAS applicationsVideo and image processing supportFull-HD video (1920 × 1080p, 60 fps)Video input and video outputUp to 2 C66x floating-point VLIW DSPFully object-code compatible with C67x and C64x+Up to thirty-two 16 × 16-bit fixed-point multiplies per cycleUp to 512kB of on-chip L3 RAMLevel 3 (L3) and Level 4 (L4) interconnectsMemory Interface (EMIF) moduleSupports DDR3/DDR3L up to DDR-1066Supports DDR2 up to DDR-800Supports LPDDR2 up to DDR-667Up to 2GB supportedDual Arm®Cortex®-M4 Image Processor Unit (IPU)Vision accelerationPacEmbedded Vision Engine (EVE)Display subsystemDisplay controller with DMA engineCVIDEO / SD-DAC TV analog composite outputVideo Input Port (VIP) moduleSupport for up to 4 multiplexed input portsOn-chip temperature sensor that is capable of generating temperature alertsGeneral-Purpose Memory Controller (GPMC)Enhanced Direct Memory Access (EDMA) controller3-port (2 external) Gigabit Ethernet (GMAC) switchController Area Network (DCAN) moduleCAN 2.0B protocolModular Controller Area Network (MCAN) moduleCAN 2.0B protocolEight 32-bit general-purpose timersThree configurable UART modulesFour Multichannel Serial Peripheral Interfaces (McSPI)Quad SPI interfaceTwo Inter-Integrated Circuit (I2C™) portsThree Multichannel Audio Serial Port (McASP) modulesSecure Digital Input Output Interface (SDIO)Up to 126 General-Purpose I/O (GPIO) pinsPower, reset, and clock managementOn-chip debug with CTools technologyAutomotive AEC-Q100 qualified15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)Seven Dual Clock Comparators (DCC)Memory Cyclic Redundancy Check (CRC)TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memoryError Signaling Module (ESM)Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers8-channel 10-bit ADCMIPI®Camera Serial Interface 2 (CSI-2)PWMSSFull HW image pipe: DPC, CFA, 3D-NF, RGB-YUVWDR, HW LDC and perspective

Description

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience. The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture. The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB. The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing. Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution. The TDA3x ADAS processor is qualified according to AEC-Q100 standard. TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience. The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture. The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB. The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing. Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution. The TDA3x ADAS processor is qualified according to AEC-Q100 standard.