Connectors, Interconnects

42-6556-10

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Aries Electronics

CONN IC DIP SOCKET 42POS GOLD

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Connectors, Interconnects

42-6556-10

Active

Aries Electronics

CONN IC DIP SOCKET 42POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	42-6556-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	42
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	3.3 mm
Termination Post Length	0.13 in
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

42-6556 Series

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Finish - Post	Features	Contact Finish - Mating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type [custom]	Type [custom]	Type	Number of Positions or Pins (Grid)	Housing Material	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Mounting Type	Termination
Aries Electronics 42-6556-40	UL94 V-0	0.18 in	4.57 mm	3 A	Tin	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole
Aries Electronics 42-6556-31	UL94 V-0	0.423 in	10.74 mm	3 A	Gold	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole	Wire Wrap
Aries Electronics 42-6556-11	UL94 V-0	0.13 in	3.3 mm	3 A	Gold	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole	Solder
Aries Electronics 42-6556-21	UL94 V-0	0.283 "	7.19 mm	3 A	Gold	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole	Wire Wrap
Aries Electronics 42-6556-41	UL94 V-0	0.18 in	4.57 mm	3 A	Gold	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole
Aries Electronics 42-6556-10	UL94 V-0	0.13 in	3.3 mm	3 A	Tin	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole	Solder
Aries Electronics 42-6556-30	UL94 V-0	0.423 in	10.74 mm	3 A	Tin	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole	Wire Wrap
Aries Electronics 42-6556-20	UL94 V-0	0.283 "	7.19 mm	3 A	Tin	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	42	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.76 Ám	30 Áin	Brass	Through Hole	Wire Wrap

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	35	$ 13.79
	N/A	0	$ 13.92

Description

General part information

42-6556 Series

42 (2 x 21) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources