Zenode.ai Logo
Beta
32 PowerDIP
Discrete Semiconductor Products

STGSB200M65DF2AG

Active
STMicroelectronics

AUTOMOTIVE-GRADE TRENCH GATE FIELD-STOP, 650 V, 200 A LOW-LOSS M SERIES IGBT IN AN ACEPACK SMIT PACKAGE

Deep-Dive with AI

Search across all available documentation for this part.

32 PowerDIP
Discrete Semiconductor Products

STGSB200M65DF2AG

Active
STMicroelectronics

AUTOMOTIVE-GRADE TRENCH GATE FIELD-STOP, 650 V, 200 A LOW-LOSS M SERIES IGBT IN AN ACEPACK SMIT PACKAGE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSTGSB200M65DF2AG
Current - Collector (Ic) (Max) [Max]216 A
Current - Collector Pulsed (Icm)700 A
Gate Charge554 nC
GradeAutomotive
IGBT TypeTrench Field Stop
Mounting TypeSurface Mount
Operating Temperature [Max]175 °C
Operating Temperature [Min]-55 °C
Package / Case9-PowerSMD
Power - Max [Max]714 W
QualificationAEC-Q101
Reverse Recovery Time (trr)174.5 ns
Supplier Device Package9-ACEPACK SMIT
Switching Energy6.97 mJ, 3.82 mJ
Td (on/off) @ 25°C [custom]250 ns
Td (on/off) @ 25°C [custom]122 ns
Test Condition400 V, 15 V, 4.7 Ohm, 200 A
Vce(on) (Max) @ Vge, Ic [Max]2.05 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 21.35
10$ 15.35
200$ 12.28
N/A 40$ 21.35
NewarkEach (Supplied on Cut Tape) 1$ 27.61
10$ 21.98
25$ 21.97
50$ 21.07
100$ 20.16
400$ 19.36

Description

General part information

STGSB200 Series

This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the M series IGBTs, which represent an optimal balance between inverter system performance and efficiency where the low-loss and the short-circuit functionality is essential. Furthermore, the positive VCE(sat)temperature coefficient and the tight parameter distribution result in safer paralleling operation. Thanks to the DBC substrate, the ACEPACK SMIT surface mounting power package offers a low thermal resistance coupled with a electrical isolated top side thermal pad.