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Discrete Semiconductor Products

RGS80TSX2GC11

Active
Rohm Semiconductor

INSULATED GATE BIPOLAR TRANSISTOR, 40A I(C), 1200V V(BR)CES, N-CHANNEL, TO-247, TO-247N, 3 PIN

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Product dimension image
Discrete Semiconductor Products

RGS80TSX2GC11

Active
Rohm Semiconductor

INSULATED GATE BIPOLAR TRANSISTOR, 40A I(C), 1200V V(BR)CES, N-CHANNEL, TO-247, TO-247N, 3 PIN

Technical Specifications

Parameters and characteristics for this part

SpecificationRGS80TSX2GC11
Current - Collector (Ic) (Max) [Max]80 A
Current - Collector Pulsed (Icm)120 A
Gate Charge104 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]555 W
Supplier Device PackageTO-247N
Td (on/off) @ 25°C49 ns, 199 ns
Test Condition40 A, 15 V, 600 V, 10 Ohm
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max) [Max]1200 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 11.10
30$ 6.62
120$ 5.64
510$ 5.28
NewarkEach 1$ 7.02
10$ 6.26
25$ 5.49
50$ 5.49
100$ 5.49
250$ 5.48
900$ 5.48

Description

General part information

RGS80TS65DHR Series

The RGS80TSX2 is a 10µs SCSOA guaranteed IGBT, suitable for PFC, UPS, IH and Power Conditioner. The RGS series delivers low conduction loss that contributes to reducing size and to improving efficiency of applications.

Documents

Technical documentation and resources

Anti-Whisker formation

Package Information

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

Moisture Sensitivity Level

Package Information

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models