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TO-247N
Discrete Semiconductor Products

RGS80TS65DHRC11

Active
Rohm Semiconductor

8ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

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TO-247N
Discrete Semiconductor Products

RGS80TS65DHRC11

Active
Rohm Semiconductor

8ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRGS80TS65DHRC11
Current - Collector (Ic) (Max)73 A
Current - Collector Pulsed (Icm)120 A
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]272 W
Reverse Recovery Time (trr)103 ns
Supplier Device PackageTO-247N
Switching Energy1.03 mJ, 1.05 mJ
Td (on/off) @ 25°C37 ns, 112 ns
Test Condition10 Ohm, 40 A, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 9.09
30$ 5.33
120$ 4.50
510$ 4.02

Description

General part information

RGS80TS65DHR Series

The RGS80TSX2 is a 10µs SCSOA guaranteed IGBT, suitable for PFC, UPS, IH and Power Conditioner. The RGS series delivers low conduction loss that contributes to reducing size and to improving efficiency of applications.

Documents

Technical documentation and resources

Moisture Sensitivity Level

Package Information

Types and Features of Transistors

Application Note

Simulation Guide for PTC Heater Thermal Simulation (ROHM Solution Simulator)

Simulations

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Reliability Test Result

Manufacturing Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the ELV directive

Environmental Data

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

About Export Administration Regulations (EAR)

Export Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Anti-Whisker formation

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

RGS80TS65DHR Data Sheet

Data Sheet

Inner Structure

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design