DSPIC33EP512GP504-E/ML
ActiveMCU 16-BIT DSPIC RISC 512KB FLASH 3.3V 44-PIN QFN EP TUBE AUTOMOTIVE AEC-Q100
Deep-Dive with AI
Search across all available documentation for this part.
DSPIC33EP512GP504-E/ML
ActiveMCU 16-BIT DSPIC RISC 512KB FLASH 3.3V 44-PIN QFN EP TUBE AUTOMOTIVE AEC-Q100
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | DSPIC33EP512GP504-E/ML |
|---|---|
| Connectivity | IrDA, UART/USART, I2C, CANbus, SPI, LINbus |
| Core Processor | dsPIC |
| Core Size | 16-Bit |
| Data Converters | A/D 9x10b/12b |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Number of I/O | 35 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 44-VQFN Exposed Pad |
| Peripherals | Brown-out Detect/Reset, DMA, POR, WDT, PWM |
| Program Memory Size | 512 KB |
| Program Memory Type | FLASH |
| Qualification | AEC-Q100 |
| RAM Size | 24 K |
| Speed | 60 MIPs |
| Supplier Device Package | 44-QFN (8x8) |
dsPIC33EP512GP504 Series
16-Bit DSC, Hi-Speed PWM, Op Amps, Adv Analog
| Part | Peripherals | Operating Temperature [Max] | Operating Temperature [Min] | Data Converters | Oscillator Type | Number of I/O | Program Memory Size | Supplier Device Package | Core Size | Connectivity | Speed | Mounting Type | Package / Case | RAM Size | Program Memory Type | Core Processor | Qualification | Grade |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | Brown-out Detect/Reset DMA POR PWM WDT | 85 °C | -40 °C | A/D 9x10b/12b | Internal | 35 | 512 KB | 48-UQFN (6x6) | 16-Bit | CANbus I2C IrDA LINbus SPI UART/USART | 70 MIPs | Surface Mount | 48-UFQFN Exposed Pad | 24 K | FLASH | dsPIC | ||
Microchip Technology | Brown-out Detect/Reset DMA POR PWM WDT | 125 °C | -40 °C | A/D 9x10b/12b | Internal | 35 | 512 KB | 44-QFN (8x8) | 16-Bit | CANbus I2C IrDA LINbus SPI UART/USART | 60 MIPs | Surface Mount | 44-VQFN Exposed Pad | 24 K | FLASH | dsPIC | AEC-Q100 | Automotive |
 Microchip Technology | Brown-out Detect/Reset DMA POR PWM WDT | 85 °C | -40 °C | A/D 9x10b/12b | Internal | 35 | 512 KB | 44-QFN (8x8) | 16-Bit | CANbus I2C IrDA LINbus SPI UART/USART | 70 MIPs | Surface Mount | 44-VQFN Exposed Pad | 24 K | FLASH | dsPIC | ||
 Microchip Technology | Brown-out Detect/Reset DMA POR PWM WDT | 125 °C | -40 °C | A/D 9x10b/12b | Internal | 35 | 512 KB | 44-VTLA (6x6) | 16-Bit | CANbus I2C IrDA LINbus SPI UART/USART | 60 MIPs | Surface Mount | 44-VFTLA Exposed Pad | 24 K | FLASH | dsPIC | AEC-Q100 | Automotive |
Microchip Technology | Brown-out Detect/Reset DMA POR PWM WDT | 85 °C | -40 °C | A/D 9x10b/12b | Internal | 35 | 512 KB | 44-QFN (8x8) | 16-Bit | CANbus I2C IrDA LINbus SPI UART/USART | 70 MIPs | Surface Mount | 44-VQFN Exposed Pad | 24 K | FLASH | dsPIC | ||
 Microchip Technology | Brown-out Detect/Reset DMA POR PWM WDT | 85 °C | -40 °C | A/D 9x10b/12b | Internal | 35 | 512 KB | 48-UQFN (6x6) | 16-Bit | CANbus I2C IrDA LINbus SPI UART/USART | 70 MIPs | Surface Mount | 48-UFQFN Exposed Pad | 24 K | FLASH | dsPIC | ||
 Microchip Technology | Brown-out Detect/Reset DMA POR PWM WDT | 125 °C | -40 °C | A/D 9x10b/12b | Internal | 35 | 512 KB | 48-UQFN (6x6) | 16-Bit | CANbus I2C IrDA LINbus SPI UART/USART | 60 MIPs | Surface Mount | 48-UFQFN Exposed Pad | 24 K | FLASH | dsPIC | AEC-Q100 | Automotive |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 135 | $ 5.50 | |
| Microchip Direct | TUBE | 1 | $ 6.59 | |
| 25 | $ 6.06 | |||
| 100 | $ 5.50 | |||
| 1000 | $ 5.05 | |||
| 5000 | $ 4.80 | |||
Description
General part information
dsPIC33EP512GP504 Series
Microchip’s dsPIC33E general purpose DSC family features the highest speed 70 MIPS core with excellent performance and code density. It offers superior ADC performance, CAN communication, CTMU, Op Amps and Peripheral Trigger Generator (PTG) for high-end general purpose applications. These devices are available in various packages and with an extended (125°C) temp option.
Documents
Technical documentation and resources