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Discrete Semiconductor Products

R6024ENJTL

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Rohm Semiconductor

600V 24A TO-263, LOW-NOISE POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

R6024ENJTL

Active
Rohm Semiconductor

600V 24A TO-263, LOW-NOISE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6024ENJTL
Current - Continuous Drain (Id) @ 25°C24 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]70 nC
Input Capacitance (Ciss) (Max) @ Vds1650 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
Power Dissipation (Max)40 W
Rds On (Max) @ Id, Vgs165 mOhm
Supplier Device PackageLPTS
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.66
10$ 3.08
100$ 2.49
500$ 2.21
Digi-Reel® 1$ 3.66
10$ 3.08
100$ 2.49
500$ 2.21
Tape & Reel (TR) 1000$ 1.71
NewarkEach (Supplied on Cut Tape) 1$ 3.81
10$ 2.89
25$ 2.84
50$ 2.52
100$ 2.35
300$ 2.16
500$ 2.09
1000$ 2.03

Description

General part information

R6024ENZ4 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

Explanation for Marking

Package Information

About Flammability of Materials

Environmental Data

Inner Structure

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Package Dimensions

Package Information

ESD Data

Characteristics Data

Two-Resistor Model for Thermal Simulation

Thermal Design

What Is Thermal Design

Thermal Design

Part Explanation

Application Note

R6024ENJ Data Sheet

Data Sheet

How to Create Symbols for PSpice Models

Models

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

About Export Regulations

Export Information

Taping Information

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Types and Features of Transistors

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article