Soldering, Desoldering, Rework Products

70-3205-1810

Obsolete

SOLDER PASTE NXG1 NO CLEAN 500GM

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Soldering, Desoldering, Rework Products

Obsolete

SOLDER PASTE NXG1 NO CLEAN 500GM

Technical Specifications

Parameters and characteristics for this part

Specification	70-3205-1810

Composition	Sn99.3Cu0.7 (99.3/0.7)
Flux Type	No-Clean
Form	17.64 oz, 500 g
Form	Jar
Melting Point	441 °F
Melting Point	227 °C
Shelf Life	8 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature [Max]	10 °C
Storage/Refrigeration Temperature [Min]	32 °F
Type	Solder Paste

Part	Shipping Info	Flux Type	Composition	Shelf Life Start	Form	Form	Shelf Life	Type	Melting Point	Melting Point	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Form	Melting Point [Max]	Melting Point [Min]	Melting Point [Min]	Melting Point [Max]	Mesh Type
Kester Solder 70-3205-1810	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	No-Clean	Sn99.3Cu0.7 (99.3/0.7)	Date of Manufacture	17.64 oz 500 g	Jar	8 Months	Solder Paste	441 °F	227 °C	32 °F	10 °C
Kester Solder 70-3205-0819	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	No-Clean	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	Date of Manufacture	700 g	Cartridge	8 Months	Solder Paste			32 °F	10 °C	24.69 oz	218 °C	217 °C	423 °F	424 °F	3

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

General part information

Lead Free No-Clean Solder Paste Sn99.3Cu0.7 (99.3/0.7) Jar, 17.64 oz (500g)

Technical documentation and resources