70-3205 Series
Manufacturer: Kester Solder
SOLDER PASTE NXG1 NO CLEAN 500GM
| Part | Shipping Info | Flux Type | Composition | Shelf Life Start | Form | Form | Shelf Life | Type | Melting Point | Melting Point | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Form | Melting Point [Max] | Melting Point [Min] | Melting Point [Min] | Melting Point [Max] | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | No-Clean | Sn99.3Cu0.7 (99.3/0.7) | Date of Manufacture | 17.64 oz 500 g | Jar | 8 Months | Solder Paste | 441 °F | 227 °C | 32 °F | 10 °C | ||||||
Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 700 g | Cartridge | 8 Months | Solder Paste | 32 °F | 10 °C | 24.69 oz | 218 °C | 217 °C | 423 °F | 424 °F | 3 |