Specification	ISO6731FDWR

Channel Type	Unidirectional
Common Mode Transient Immunity (Min) [Min]	50 kV/çs
Data Rate	50 Mbps
Inputs - Side 1/Side 2 [custom]	2
Inputs - Side 1/Side 2 [custom]	1
Isolated Power	False
Mounting Type	Surface Mount
Number of Channels [custom]	3
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	16-SOIC
Package / Case [x]	0.295 in
Package / Case [y]	7.5 mm
Propagation Delay tpLH / tpHL (Max) [Max]	18 ns
Pulse Width Distortion (Max) [Max]	7 ns
Rise / Fall Time (Typ) [custom]	2.6 ns
Rise / Fall Time (Typ) [custom]	2.6 ns
Supplier Device Package	16-SOIC
Technology	Capacitive Coupling
Type	SPI, RS232, RS485, CAN
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	2.25 V

ISO6731-Q1 Series

Automotive, general-purpose, triple-channel, 2/1, digital isolator

Part	Number of Channels [custom]	Propagation Delay tpLH / tpHL (Max) [Max]	Type	Common Mode Transient Immunity (Min) [Min]	Rise / Fall Time (Typ) [custom]	Rise / Fall Time (Typ) [custom]	Technology	Supplier Device Package	Package / Case [x]	Package / Case	Package / Case [y]	Operating Temperature [Max]	Operating Temperature [Min]	Data Rate	Channel Type	Mounting Type	Voltage - Supply [Max]	Voltage - Supply [Min]	Inputs - Side 1/Side 2 [custom]	Inputs - Side 1/Side 2 [custom]	Pulse Width Distortion (Max) [Max]	Qualification	Grade
Texas Instruments ISO6731DWR	3	18 ns	CAN RS232 RS485 SPI	50 kV/çs	2.6 ns	2.6 ns	Capacitive Coupling	16-SOIC	0.295 in	16-SOIC	7.5 mm	125 °C	-40 °C	50 Mbps	Unidirectional	Surface Mount	5.5 V	2.25 V	2	1	7 ns
Texas Instruments ISO6731FQDWRQ1	3	18 ns		50 kV/çs	2.6 ns	2.6 ns	Capacitive Coupling	16-SOIC	0.295 in	16-SOIC	7.5 mm	125 °C	-40 °C	50 Mbps	Unidirectional	Surface Mount	5.5 V	2.25 V	2	1	7 ns	AEC-Q100	Automotive
Texas Instruments ISO6731QDWRQ1	3	18 ns		50 kV/çs	2.6 ns	2.6 ns	Capacitive Coupling	16-SOIC	0.295 in	16-SOIC	7.5 mm	125 °C	-40 °C	50 Mbps	Unidirectional	Surface Mount	5.5 V	2.25 V	2	1	7 ns	AEC-Q100	Automotive
Texas Instruments ISO6731FDWR	3	18 ns	CAN RS232 RS485 SPI	50 kV/çs	2.6 ns	2.6 ns	Capacitive Coupling	16-SOIC	0.295 in	16-SOIC	7.5 mm	125 °C	-40 °C	50 Mbps	Unidirectional	Surface Mount	5.5 V	2.25 V	2	1	7 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 2.24
		10	$ 2.01
		25	$ 1.90
		100	$ 1.62
		250	$ 1.52
		500	$ 1.33
		1000	$ 1.10
	Digi-Reel®	1	$ 2.24
		10	$ 2.01
		25	$ 1.90
		100	$ 1.62
		250	$ 1.52
		500	$ 1.33
		1000	$ 1.10
	Tape & Reel (TR)	2000	$ 1.03
		6000	$ 0.99
		10000	$ 0.95
Texas Instruments	LARGE T&R	1	$ 1.62
		100	$ 1.25
		250	$ 0.92
		1000	$ 0.66

Description

General part information

ISO6731-Q1 Series

The ISO6731-Q1 device is a high-performance, triple-channel digital isolators ideal for cost-sensitive applications requiring up to 5000 VRMSisolation ratings per UL 1577. This device is also certified by VDE, TUV, CSA, and CQC.

The ISO6731-Q1 devics provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications. The ISO6731-Q1 device has two forward and one reverse-direction channels. In the event of input power or signal loss, the default output ishighfor the device without suffix F andlowfor the device with suffix F. See Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6731-Q1 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO6731-Q1 device is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.