Specification	ADS5444HFG/EM

Architecture	Pipelined
Configuration	S/H-ADC
Data Interface	LVDS - Parallel
Input Type	Differential
Mounting Type	Surface Mount
Number of A/D Converters	1
Number of Bits	13
Number of Inputs	1
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	84-CFlatPack
Ratio - S/H:ADC	1:1
Reference Type	Internal
Sampling Rate (Per Second)	250 M
Supplier Device Package	84-CFP
Supplier Device Package [x]	40.77
Supplier Device Package [y]	40.77
Voltage - Supply, Analog	5 V
Voltage - Supply, Digital	5 V

ADS5444-SP Series

13-bit 250-MSPS analog-to-digital converter (ADC) - enhanced product

Part	Power (Typ) @ Conditions	Utilized IC / Part	Number of A/D Converters	Sampling Rate (Per Second)	Supplied Contents	Data Interface	Input Range	Number of Bits	Mounting Type	Configuration	Package / Case	Ratio - S/H:ADC	Number of Inputs	Input Type	Reference Type	Voltage - Supply, Analog	Supplier Device Package	Voltage - Supply, Digital	Operating Temperature [Max]	Operating Temperature [Min]	Architecture	Supplier Device Package [y]	Supplier Device Package [x]
Texas Instruments ADS5444EVM-CVAL	2 W	ADS5444-SP	1	250 M	Board(s)	LVDS - Parallel	2.2 Vpp	13
Texas Instruments ADS5444IPFPR			1	250 M		Parallel		13	Surface Mount	S/H-ADC	80-TQFP Exposed Pad	1:1	1	Differential	Internal	5 V	80-HTQFP (12x12)	5 V	85 °C	-40 °C	Pipelined
Texas Instruments ADS5444HFG/EM			1	250 M		LVDS - Parallel		13	Surface Mount	S/H-ADC	84-CFlatPack	1:1	1	Differential	Internal	5 V	84-CFP	5 V	85 °C	-40 °C	Pipelined	40.77	40.77
Texas Instruments ADS5444MPFPEP			1	250 M		Parallel		13	Surface Mount	S/H-ADC	80-TQFP Exposed Pad	1:1	1	Differential	Internal	5 V	80-HTQFP (12x12)	5 V	125 °C	-55 °C	Pipelined

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 1528.98
Texas Instruments	OTHER	1	$ 3472.77
		10	$ 3286.73
		100	$ 3100.69

Description

General part information

ADS5444-SP Series

The ADS5444 is a 13 bit 250 MSPS analog-to-digital converter (ADC) that operates from a 5 V supply, while providing LVDS-compatible digital outputs from a 3.3 V supply. The ADS5444 input buffer isolates the internal switching of the onboard track and hold (T&H) from disturbing the signal source. An internal reference generator is also provided to further simplify the system design. The ADS5444 has outstanding low noise and linearity over input frequency.

The ADS5444 is available in a 84 pin ceramic nonconductive tie-bar package (HFG). The ADS5444 is built on a state-of-the-art Texas Instruments complementary bipolar process (BiCom3X) and is specified over the full military temperature range (–55°C to 125°C Tcase).

This CQFP package has built in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI typically recommends an 11,9-mm2board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad must be electrically at ground potential.