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353_TO220-3_TO220AB__3
Discrete Semiconductor Products

RB088T100NZC9

Active
Rohm Semiconductor

SUPER LOW IR, 100V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE

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353_TO220-3_TO220AB__3
Discrete Semiconductor Products

RB088T100NZC9

Active
Rohm Semiconductor

SUPER LOW IR, 100V, 10A, ITO-220AB, SCHOTTKY BARRIER DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRB088T100NZC9
Current - Average Rectified (Io) (per Diode)10 A
Current - Reverse Leakage @ Vr5 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-3 Full Pack
Speed500 ns, 200 mA
Supplier Device PackageTO-220FN
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If870 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 968$ 2.13
Tube 1$ 0.81
50$ 0.65
100$ 0.51
500$ 0.44
1000$ 0.43

Description

General part information

RB088 Series

RB088NS200FH is the 200V ultra-low IRSBD optimized for automotive applications including powertrains and xEVs. It offers ultra-low leakage current (IR) characteristics to achieve high withstand voltage of 200V. Replacing FRDs and rectifier diodes typically used in vehicle systems with ROHM's new SBDs make it possible to improve forward voltage (VF) characteristics significantly (11% lower than conventional FRDs). This reduces application power losses and allows smaller package designs by reducing heat generation, contributing to greater space savings.About the RBxx8 series: SBDs featuring superior efficiency are expected to replace conventional rectifier diodes and FRDs in automotive power supply exposed to high temperature. However, one drawback of SBDs is degraded IRcharacteristics at higher operating temperatures that can lead to thermal runaway, requiring products that provide stable operation at higher temperatures. The RBxx8 series utilizes a barrier metal optimized for high temperature that significantly improves the IRcharacteristics (which is perhaps the most important challenge when using SBDs in automotive power supply). This ensures safe operation at high temperatures in automotive and industrial applications, eliminating the possibility of thermal runaway.

Documents

Technical documentation and resources

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Create Symbols for PSpice Models

Models

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Part Explanation

Application Note

List of Diode Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

Diode Types and Applications

Technical Article

Inner Structure

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Rectifier Diodes

Technical Article

About Export Regulations

Export Information

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Diode)

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Taping Information

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Package Dimensions

Package Information

RB088T100NZ Data Sheet

Data Sheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

ESD Data

Characteristics Data

Reliability Test Result

Manufacturing Data

Moisture Sensitivity Level - Diodes

Package Information

Explanation for Marking

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Diodes

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design