STM32F413ZHT3
ActiveHIGH-PERFORMANCE ACCESS LINE, ARM CORTEX-M4 CORE WITH DSP AND FPU, 1,5 MBYTE OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM
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STM32F413ZHT3
ActiveHIGH-PERFORMANCE ACCESS LINE, ARM CORTEX-M4 CORE WITH DSP AND FPU, 1,5 MBYTE OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM
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Technical Specifications
Parameters and characteristics for this part
| Specification | STM32F413ZHT3 |
|---|---|
| Connectivity | SPI, SAI, LINbus, CANbus, EBI/EMI, QSPI, MMC/SDIO, IrDA, UART/USART, I2C, USB OTG |
| Core Processor | ARM® Cortex®-M4 |
| Core Size | 32-Bit |
| Data Converters | D/A 2x12b, A/D 16x12b |
| Mounting Type | Surface Mount |
| Number of I/O | 114 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 144-LQFP |
| Peripherals | WDT, I2S, DMA, PWM, POR, Brown-out Detect/Reset, LCD |
| Program Memory Size | 1.5 MB |
| Program Memory Type | FLASH |
| RAM Size | 320 K |
| Speed | 100 MHz |
| Supplier Device Package | 144-LQFP (20x20) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
STM32F413ZH Series
The STM32F413xG/H devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32F413xG/H devices belong to the STM32F4 access product lines (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F413xG/H devices incorporate high-speed embedded memories (up to 1.5 Mbytes of Flash memory, 320 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
Documents
Technical documentation and resources
