Connectors, Interconnects

517-83-325-18-111111

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Preci-Dip

CONN SOCKET PGA 325POS GOLD

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Connectors, Interconnects

517-83-325-18-111111

Active

Preci-Dip

CONN SOCKET PGA 325POS GOLD

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	517-83-325-18-111111

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating [custom]	29.5 µin
Contact Finish Thickness - Mating [custom]	0.75 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	325
Number of Positions or Pins (Grid) [x]	18
Number of Positions or Pins (Grid) [y]	18
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	PGA

517-83 Series

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Resistance	Material Flammability Rating	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Features	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Housing Material	Mounting Type	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Type	Contact Material - Post [custom]	Contact Finish - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)
Preci-Dip 517-83-539-20-101111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm	20	20	539
Preci-Dip 517-83-361-18-101111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm	18	18	361
Preci-Dip 517-83-369-18-091111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm			369
Preci-Dip 517-83-403-19-111111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm			403
Preci-Dip 517-83-529-21-121111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm	21	21	529
Preci-Dip 517-83-565-21-111111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm	21	21	565
Preci-Dip 517-83-447-20-121111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm			447
Preci-Dip 517-83-325-18-111111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm	18	18	325
Preci-Dip 517-83-401-19-101111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm	19	19	401
Preci-Dip 517-83-365-17-091111	0.125 in	3.18 mm	1 A	10 mOhm	UL94 V-0	29.5 µin	0.75 µm	Open Frame	-55 C	125 °C	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Through Hole	Beryllium Copper	0.1 "	2.54 mm	Gold	PGA	Brass	Tin	0.1 in	2.54 mm	17	17	365

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	264	$ 21.95
	N/A	0	$ 21.95

Description

General part information

517-83 Series

325 (18 x 18) Pos PGA Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available