Specification	AM5718AABCX

Additional Interfaces	CAN, McASP, PCIe, QSPI, I2C, UART, MMC/SD/SDIO, HDQ/1-Wire\, EBI/EMI, McSPI
Co-Processors/DSP	VFP, IPU, Multimedia, GPU
Core Processor	ARM® Cortex®-A15
Display & Interface Controllers	HDMI
Ethernet	10 Mbps, 100 Mbps, 1000 Mbps
Graphics Acceleration	True
Mounting Type	Surface Mount
Number of Cores/Bus Width	32 Bit, 1 Core
Operating Temperature [Max]	90 °C
Operating Temperature [Min]	0 °C
Package / Case	FCBGA, 760-BFBGA
RAM Controllers	DDR3, SRAM
SATA	3 Gbps
Speed	1.5 GHz
Supplier Device Package	760-FCBGA (23x23)
USB [custom]	USB 2.0 (1), USB 3.0 (1)
Voltage - I/O	3.3 V, 1.8 V

AM5718-HIREL Series

AM5718-HIREL Sitara™ Processors Silicon Revision 2.0

Part	Supplier Device Package	Grade	Qualification	Ethernet	Display & Interface Controllers	Voltage - I/O	Number of Cores/Bus Width	Co-Processors/DSP	RAM Controllers	SATA	Operating Temperature [Min]	Operating Temperature [Max]	Core Processor	USB [custom]	Speed	Mounting Type	Package / Case	Additional Interfaces	USB	Ethernet	Ethernet [Max]	Ethernet [Min]	Operating Temperature [custom]
Texas Instruments AM5718AABCXEQ1	760-FCBGA (23x23)	Automotive	AEC-Q100	10 Mbps 100 Mbps 1000 Mbps	HDMI LCD	1.8 V 3.3 V	1 Core 32 Bit	GPU IPU Multimedia VFP	DDR3 SRAM	3 Gbps	-40 °C	125 ¯C	ARM® Cortex®-A15	USB 2.0 (1) USB 3.0 (1)	1.5 GHz	Surface Mount	760-BFBGA FCBGA	CAN EBI/EMI HDQ/1-Wire\ I2C McASP McSPI MMC/SD/SDIO PCIe QSPI UART
Texas Instruments AM5718AABCX	760-FCBGA (23x23)			10 Mbps 100 Mbps 1000 Mbps	HDMI	1.8 V 3.3 V	1 Core 32 Bit	GPU IPU Multimedia VFP	DDR3 SRAM	3 Gbps	0 °C	90 °C	ARM® Cortex®-A15	USB 2.0 (1) USB 3.0 (1)	1.5 GHz	Surface Mount	760-BFBGA FCBGA	CAN EBI/EMI HDQ/1-Wire\ I2C McASP McSPI MMC/SD/SDIO PCIe QSPI UART
Texas Instruments AM5718AZBOXEM	780-FCBGA (23x23)					1.8 V 3.3 V	1 Core 32 Bit	BB2D DSP GPU IPU IVA VPE	DDR3 DDR3L	3 Gbps	-55 °C	125 °C	ARM® Cortex®-A15		1.5 GHz	Surface Mount	780-BGA FCBGA	CAN EBI/EMI HDQ/1-Wire\ I2C McASP McSPI MMC/SD/SDIO PCIe QSPI UART	PHY (2) USB 2.0 (2) USB 3.0 (2)
Texas Instruments AM5718ABCXE	760-FCBGA (23x23)					1.8 V 3.3 V	1 Core 32 Bit	GPU IPU Multimedia VFP	DDR3 SRAM	3 Gbps	0 °C	90 °C	ARM® Cortex®-A15	USB 2.0 (1) USB 3.0 (1)	1.5 GHz	Surface Mount	760-BFBGA FCBGA			1	100 Mbps	10 Mbps
Texas Instruments AM5718AABCXEA	760-FCBGA (23x23)			10 Mbps 100 Mbps 1000 Mbps	HDMI	1.8 V 3.3 V	1 Core 32 Bit	GPU IPU Multimedia VFP	DDR3 SRAM	3 Gbps			ARM® Cortex®-A15	USB 2.0 (1) USB 3.0 (1)	1.5 GHz	Surface Mount	760-BFBGA FCBGA	CAN EBI/EMI HDQ/1-Wire\ I2C McASP McSPI MMC/SD/SDIO PCIe QSPI UART					-40 °C 105 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 50.09
		10	$ 47.05
		60	$ 45.53
		120	$ 42.20
		240	$ 40.98
Texas Instruments	EIAJ TRAY (5+1)	1	$ 45.99
		100	$ 40.88
		250	$ 33.60
		1000	$ 30.06

Description

General part information

AM5718-HIREL Series

AM5718-HIREL Sitara ARM applications processors are built to meet the intense processing needs of the modern embedded products.

AM5718-HIREL devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The devices also combine programmable video processing with a highly integrated peripheral set.

Programmability is provided by a single-core ARM Cortex-A15 RISC CPU with Neon™ extensions and a TI C66x VLIW floating-point DSP core. The ARM processor lets developers keep control functions separate from vision algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.

Documents

Technical documentation and resources

AM5718AABCX

Deep-Dive with AI

AM5718AABCX

Deep-Dive with AI

Technical Specifications

AM5718-HIREL Series

Pricing

Description

AM5718-HIREL Series

Documents

Hypervisors in embedded systems

AM57xx Hardware Design Guide

IODELAY Application Note for AM57xx Devices (Rev. A)

There’s a core for that

Ensuring real-time predictability (Rev. B)

HSR/PRP Solutions on Sitara Processors for Grid Substation Communication

Mainline Linux™ ensures stability and innovation

Clove: Low-Power video solutions based on Sitara™ AM57x processors

AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E)

Sitara™ AM5x processor with ARM® Cortex™-A15 core (Rev. A)

AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne

AM574x, AM572x, and AM571x Compatibility Guide (Rev. E)

High-Speed Interface Layout Guidelines (Rev. J)

Secure Boot on embedded Sitara™ processors (Rev. A)

Expanding industrial communication development

Ethernet PHY Configuration Using MDIO for Industrial Applications (Rev. A)

AM571x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware UG (Rev. D)

Keystone EDMA FAQ

TPS659037 user's guide to power AM574x, AM572x, and AM571x (Rev. F)

The Yocto Project:Changing the way embedded Linux software solutions are develop

AM571x and AM570x Sitara Processor Technical Reference Manual (Rev. K)

PRU-ICSS EtherCAT Slave Troubleshooting Guide

2D Object Recognition for Industrial Machine Vision with Processor SDK on Sitara

Scalable Solutions for HMI

AM571x/AM572x/AM574x PCB Escape Routing (Rev. A)

AM57x Schematic Checklist (Rev. B)

Linaro Speeds Development in TI Linux SDKs

Common EOS pitfalls in board design

MMC DLL Tuning (Rev. B)

Intra Drive Communication Using 8b-10b Line Code With Programmable Real Time Uni

AM571x Sitara™ Processors Silicon Revision 2.0 and 2.1 datasheet (Rev. I)

PRU Read Latencies (Rev. A)

Sitara Processor Power Distribution Networks: Implementation and Analysis (Rev. G)

Time Sensitive Networking for Industrial Automation (Rev. C)

Plastic Ball Grid Array [PBGA] Application Note (Rev. B)

Processor SDK RTOS Audio Benchmark Starter Kit

Processor-SDK RTOS Power Management and Measurement

PRU-ICSS / PRU_ICSSG Migration Guide

AM57xx BGA PCB Design

How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS

Control-level design challenges in smart factory automation systems

DSPLIB for Processor SDK RTOS

Industrial Communication Protocols Supported on Sitara™ Processors (Rev. E)

Adding Real-Time Communication to Linux (Rev. A)

PRU-ICSS Feature Comparison (Rev. G)

Thermal Design Guide for DSP and Arm Application Processors (Rev. B)

PRU Assembly Instruction User Guide

Bringing deep learning to embedded systems (Rev. A)

AM57x processors for smart grid applications

AM571x Power Estimation Tool

AM571x Power Consumption Summary

TI DSP Benchmarking

AM571x (SR 2.1, 2.0, 1.0) and AM570x (SR 2.1, 2.0) Sitara Processors Errata (Rev. H)

PRU-ICSS Getting Started Guide on TI-RTOS (Rev. A)

Flip Chip Ball Grid Array Package Reference Guide (Rev. A)

AM571x Thermal Considerations

Enable security and amp up chip performance w/ hardware-accelerated cryptograpy (Rev. A)

AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)

PRU-ICSS Getting Starting Guide on Linux (Rev. A)

From Start to Finish: A Product Development Roadmap for Sitara™ Processors

AM572x GP EVM Power Simulations

AM5718-HIREL Series