Integrated Circuits (ICs)

ADBF705WCBCZ311

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BLK+PROCW/512KB L2 SRAM,DDR2

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Integrated Circuits (ICs)

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BLK+PROCW/512KB L2 SRAM,DDR2

Technical Specifications

Parameters and characteristics for this part

Specification	ADBF705WCBCZ311

Clock Rate	300 MHz
Grade	Automotive
Interface	QSPI, DSPI, SPORT, I2C, UART/USART, PPI, CAN, USB OTG, SD/SDIO, SPI, EBI/EMI
Mounting Type	Surface Mount
Non-Volatile Memory	512 kB
On-Chip RAM	512 kB
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Package / Case	184-LFBGA, CSPBGA
Supplier Device Package	184-CSPBGA (12x12)
Type	Blackfin+
Voltage - Core	1.1 V
Voltage - I/O	3.3 V, 1.8 V

Part	Package / Case	Grade	Non-Volatile Memory	Voltage - I/O	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Interface	Mounting Type	Voltage - Core	On-Chip RAM	Clock Rate	Type
Analog Devices ADBF705WCBCZ311	184-LFBGA CSPBGA	Automotive	512 kB	1.8 V 3.3 V	105 °C	-40 °C	184-CSPBGA (12x12)	CAN DSPI EBI/EMI I2C PPI QSPI SD/SDIO SPI SPORT UART/USART USB OTG	Surface Mount	1.1 V	512 kB	300 MHz	Blackfin+
Analog Devices ADBF705WCBCZ411	184-LFBGA CSPBGA	Automotive	512 kB	1.8 V 3.3 V	105 °C	-40 °C	184-CSPBGA (12x12)	CAN DSPI EBI/EMI I2C PPI QSPI SD/SDIO SPI SPORT UART/USART USB OTG	Surface Mount	1.1 V	512 kB	400 MHz	Blackfin+

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

BLK+PROCW/512KB L2 SRAM,DDR2

Technical documentation and resources