Integrated Circuits (ICs)

W25X40CLSNIG

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Winbond Electronics

IC FLASH 4MBIT SPI 104MHZ 8SOIC

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Integrated Circuits (ICs)

W25X40CLSNIG

Active

Winbond Electronics

IC FLASH 4MBIT SPI 104MHZ 8SOIC

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	W25X40CLSNIG

Clock Frequency	104 MHz
Memory Format	FLASH
Memory Interface	SPI
Memory Organization	512 K
Memory Size	512 kB
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 C
Operating Temperature [Min]	-40 ¯C
Package / Case	0.154 in
Package / Case	8-SOIC
Package / Case	3.9 mm
Supplier Device Package	8-SOIC
Technology	FLASH
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.3 V
Write Cycle Time - Word, Page	800 µs

W25X40 Series

Part	Voltage - Supply [Max]	Voltage - Supply [Min]	Memory Format	Clock Frequency	Memory Size	Mounting Type	Memory Type	Package / Case	Memory Organization	Technology	Operating Temperature [Max]	Operating Temperature [Min]	Write Cycle Time - Word, Page	Memory Interface	Supplier Device Package	Package / Case	Package / Case	Package / Case
Winbond Electronics W25X40AVZPIG	3.6 V	2.7 V	FLASH	100 MHz	512 kB	Surface Mount	Non-Volatile	8-WDFN Exposed Pad	512 K	FLASH	85 C	-40 ¯C	3 ms	SPI	8-WSON (6x5)
Winbond Electronics W25X40VSSIG T&R	3.6 V	2.7 V	FLASH	75 MHz	512 kB	Surface Mount	Non-Volatile	8-SOIC	512 K	FLASH	85 C	-40 ¯C	3 ms	SPI	8-SOIC	0.209 in 5.3 mm
Winbond Electronics W25X40CLSSIG TR	3.6 V	2.3 V	FLASH	104 MHz	512 kB	Surface Mount	Non-Volatile	8-SOIC	512 K	FLASH	85 C	-40 ¯C	800 µs	SPI	8-SOIC	0.209 in 5.3 mm
Winbond Electronics W25X40CLUXIG TR	3.6 V	2.3 V	FLASH	104 MHz	512 kB	Surface Mount	Non-Volatile	8-UFDFN Exposed Pad	512 K	FLASH	85 C	-40 ¯C	800 µs	SPI	8-USON (2x3)
Winbond Electronics W25X40CLSSIG	3.6 V	2.3 V	FLASH	104 MHz	512 kB	Surface Mount	Non-Volatile	8-SOIC	512 K	FLASH	85 C	-40 ¯C	800 µs	SPI	8-SOIC	0.209 in 5.3 mm
Winbond Electronics W25X40VZPIG	3.6 V	2.7 V	FLASH	75 MHz	512 kB	Surface Mount	Non-Volatile	8-WDFN Exposed Pad	512 K	FLASH	85 C	-40 ¯C	3 ms	SPI	8-WSON (6x5)
Winbond Electronics W25X40BVSSIG	3.6 V	2.7 V	FLASH	104 MHz	512 kB	Surface Mount	Non-Volatile	8-SOIC	512 K	FLASH	85 C	-40 ¯C	3 ms	SPI	8-SOIC	0.209 in 5.3 mm
Winbond Electronics W25X40CLSNIG	3.6 V	2.3 V	FLASH	104 MHz	512 kB	Surface Mount	Non-Volatile	8-SOIC	512 K	FLASH	85 C	-40 ¯C	800 µs	SPI	8-SOIC		0.154 in	3.9 mm
Winbond Electronics W25X40VSSIG	3.6 V	2.7 V	FLASH	75 MHz	512 kB	Surface Mount	Non-Volatile	8-SOIC	512 K	FLASH	85 C	-40 ¯C	3 ms	SPI	8-SOIC	0.209 in 5.3 mm
Winbond Electronics W25X40BVDAIG	3.6 V	2.7 V	FLASH	104 MHz	512 kB	Through Hole	Non-Volatile	8-DIP (0.300" 7.62mm)	512 K	FLASH	85 C	-40 ¯C	3 ms	SPI	8-PDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	244949	$ 0.38
	Tube	1	$ 0.31
		10	$ 0.28
		25	$ 0.26
		50	$ 0.26
		100	$ 0.25
		250	$ 0.24
		500	$ 0.23
		1000	$ 0.23

Description

General part information

W25X40 Series

FLASH Memory IC 4Mbit SPI 104 MHz 8-SOIC

Documents

Technical documentation and resources