W25X40 Series
Manufacturer: Winbond Electronics
IC FLASH 4MBIT SPI 100MHZ 8WSON
| Part | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Format | Clock Frequency | Memory Size | Mounting Type | Memory Type | Package / Case | Memory Organization | Technology | Operating Temperature [Max] | Operating Temperature [Min] | Write Cycle Time - Word, Page | Memory Interface | Supplier Device Package | Package / Case | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 100 MHz | 512 kB | Surface Mount | Non-Volatile | 8-WDFN Exposed Pad | 512 K | FLASH | 85 C | -40 ¯C | 3 ms | SPI | 8-WSON (6x5) | |||
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 75 MHz | 512 kB | Surface Mount | Non-Volatile | 8-SOIC | 512 K | FLASH | 85 C | -40 ¯C | 3 ms | SPI | 8-SOIC | 0.209 in 5.3 mm | ||
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 512 kB | Surface Mount | Non-Volatile | 8-SOIC | 512 K | FLASH | 85 C | -40 ¯C | 800 µs | SPI | 8-SOIC | 0.209 in 5.3 mm | ||
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 512 kB | Surface Mount | Non-Volatile | 8-UFDFN Exposed Pad | 512 K | FLASH | 85 C | -40 ¯C | 800 µs | SPI | 8-USON (2x3) | |||
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 512 kB | Surface Mount | Non-Volatile | 8-SOIC | 512 K | FLASH | 85 C | -40 ¯C | 800 µs | SPI | 8-SOIC | 0.209 in 5.3 mm | ||
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 75 MHz | 512 kB | Surface Mount | Non-Volatile | 8-WDFN Exposed Pad | 512 K | FLASH | 85 C | -40 ¯C | 3 ms | SPI | 8-WSON (6x5) | |||
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 104 MHz | 512 kB | Surface Mount | Non-Volatile | 8-SOIC | 512 K | FLASH | 85 C | -40 ¯C | 3 ms | SPI | 8-SOIC | 0.209 in 5.3 mm | ||
Winbond Electronics | 3.6 V | 2.3 V | FLASH | 104 MHz | 512 kB | Surface Mount | Non-Volatile | 8-SOIC | 512 K | FLASH | 85 C | -40 ¯C | 800 µs | SPI | 8-SOIC | 0.154 in | 3.9 mm | |
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 75 MHz | 512 kB | Surface Mount | Non-Volatile | 8-SOIC | 512 K | FLASH | 85 C | -40 ¯C | 3 ms | SPI | 8-SOIC | 0.209 in 5.3 mm | ||
Winbond Electronics | 3.6 V | 2.7 V | FLASH | 104 MHz | 512 kB | Through Hole | Non-Volatile | 8-DIP (0.300" 7.62mm) | 512 K | FLASH | 85 C | -40 ¯C | 3 ms | SPI | 8-PDIP |