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BA17818FP-E2
Discrete Semiconductor Products

RB085BM-30FHTL

Active
Rohm Semiconductor

SCHOTTKY RECTIFIER, 35 V, 10 A, DUAL COMMON CATHODE, TO-252 (DPAK), 3 PINS, 480 MV

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BA17818FP-E2
Discrete Semiconductor Products

RB085BM-30FHTL

Active
Rohm Semiconductor

SCHOTTKY RECTIFIER, 35 V, 10 A, DUAL COMMON CATHODE, TO-252 (DPAK), 3 PINS, 480 MV

Technical Specifications

Parameters and characteristics for this part

SpecificationRB085BM-30FHTL
Current - Average Rectified (Io) (per Diode)10 A
Current - Reverse Leakage @ Vr300 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
QualificationAEC-Q101
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If480 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.62
10$ 1.34
100$ 1.07
500$ 0.90
1000$ 0.77
Digi-Reel® 1$ 1.62
10$ 1.34
100$ 1.07
500$ 0.90
1000$ 0.77
Tape & Reel (TR) 2500$ 0.68

Description

General part information

RB085BM-30FH Series

RB085BGE-40 is low VFschottky barrier diode for general rectification. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

How to Create Symbols for PSpice Models

Models

Part Explanation

Application Note

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Package Dimensions

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Reliability Test Result

Manufacturing Data

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Constitution Materials List

Environmental Data

Moisture Sensitivity Level - Diodes

Package Information

Diode Types and Applications

Technical Article

ESD Data

Characteristics Data

About Export Regulations

Export Information

Inner Structure

Package Information

How to Select Rectifier Diodes

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification