Specification	RB085T-60HZC9

Current - Average Rectified (Io) (per Diode)	10 A
Current - Reverse Leakage @ Vr	300 µA
Diode Configuration	1 Pair Common Cathode
Grade	Automotive
Mounting Type	Through Hole
Operating Temperature - Junction [Max]	150 °C
Package / Case	TO-220-3 Full Pack
Qualification	AEC-Q101
Reverse Recovery Time (trr)	9.3 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-220FN
Technology	Schottky
Voltage - DC Reverse (Vr) (Max) [Max]	60 V
Voltage - Forward (Vf) (Max) @ If	580 mV

RB085 Series

60V, 10A, TO-252, Cathode Common, Low VFSchottky Barrier Diode

Part	Current - Average Rectified (Io) (per Diode)	Current - Reverse Leakage @ Vr	Mounting Type	Speed	Operating Temperature - Junction	Diode Configuration	Supplier Device Package	Voltage - Forward (Vf) (Max) @ If	Voltage - DC Reverse (Vr) (Max) [Max]	Package / Case	Technology	Voltage - Forward (Vf) (Max) @ If [Max]	Operating Temperature - Junction [Max]	Current - Average Rectified (Io)	Reverse Recovery Time (trr)	Qualification	Grade
Rohm Semiconductor RB085T-60NZC9	10 A	300 µA	Through Hole	200 mA 500 ns	150 ¯C	1 Pair Common Cathode	TO-220FN	580 mV	60 V	TO-220-3 Full Pack	Schottky
Rohm Semiconductor RB085BM-40TL		200 µA	Surface Mount	200 mA 500 ns			TO-252		45 V	DPAK (2 Leads + Tab) SC-63 TO-252-3	Schottky	550 mV	150 °C	10 A
Rohm Semiconductor RB085BGE-90TL	5 A	150 µA	Surface Mount	200 mA 500 ns	150 ¯C	1 Pair Common Cathode	TO-252GE	830 mV		DPAK (2 Leads + Tab) SC-63 TO-252-3	Schottky
Rohm Semiconductor RB085BGE-60TL	5 A	300 µA	Surface Mount	200 mA 500 ns	150 ¯C	1 Pair Common Cathode	TO-252GE	580 mV	60 V	DPAK (2 Leads + Tab) SC-63 TO-252-3	Schottky
Rohm Semiconductor RB085T-60HZC9	10 A	300 µA	Through Hole	200 mA 500 ns		1 Pair Common Cathode	TO-220FN	580 mV	60 V	TO-220-3 Full Pack	Schottky		150 °C		9.3 ns	AEC-Q101	Automotive
Rohm Semiconductor RB085BM-30FHTL	10 A	300 µA	Surface Mount	200 mA 500 ns		1 Pair Common Cathode	TO-252	480 mV	30 V	DPAK (2 Leads + Tab) SC-63 TO-252-3	Schottky		150 °C			AEC-Q101	Automotive
Rohm Semiconductor RB085BGE-40TL	10 A	200 µA	Surface Mount	200 mA 500 ns		1 Pair Common Cathode	TO-252		40 V	DPAK (2 Leads + Tab) SC-63 TO-252-3	Schottky	550 mV	150 °C
Rohm Semiconductor RB085BM-30TL	5 A	300 µA	Surface Mount	200 mA 500 ns		1 Pair Common Cathode	TO-252	480 mV	30 V	DPAK (2 Leads + Tab) SC-63 TO-252-3	Schottky		150 °C
Rohm Semiconductor RB085BGE-30TL	10 A	300 µA	Surface Mount			1 Pair Common Cathode	TO-252	480 mV	30 V	DPAK (2 Leads + Tab) SC-63 TO-252-3	Schottky		150 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	1000	$ 1.65
	Tube	1	$ 1.07
		50	$ 0.86
		100	$ 0.68
		500	$ 0.58
		1000	$ 0.47
		2000	$ 0.44
		5000	$ 0.42
		10000	$ 0.40

Description

General part information

RB085 Series

RB085BGE-40 is low VFschottky barrier diode for general rectification. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Documents

Technical documentation and resources

Diode Flammability

AEC-Q101 Automotive Requirements

TO220FND 3Pin C9 Taping Spec

Datasheet

TO-220FN Part Marking

Moisture Sensitivity Level - Diodes

Package Information

θJA and ΨJT

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

RB085T-60HZC9

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RB085T-60HZC9

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Technical Specifications

RB085 Series

Pricing

Description

RB085 Series

Documents

Diode Flammability

AEC-Q101 Automotive Requirements

TO220FND 3Pin C9 Taping Spec

TO-220FN Part Marking

Moisture Sensitivity Level - Diodes

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Method for Monitoring Switching Waveform

How to Select Reverse Current Protection Diodes for LDO Regulators

How to Use LTspice&reg; Models: Tips for Improving Convergence

Reliability Test Result

Diode Types and Applications

Diode Selection Method for Asynchronous Converter

PCB Layout Thermal Design Guide

Impedance Characteristics of Bypass Capacitor

Basics of Thermal Resistance and Heat Dissipation

Notes for Temperature Measurement Using Thermocouples

Notes for Calculating Power Consumption:Static Operation

What Is Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Anti-Whisker formation - Diodes

Measurement Method and Usage of Thermal Resistance RthJC

How to Use the Thermal Resistance and Thermal Characteristics Parameters

About Export Regulations

Absolute Maximum Rating and Electrical Characteristics of Diodes

Certificate of not containing SVHC under REACH Regulation

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Inner Structure

Part Explanation

Compliance of the RoHS directive

RB085T-60HZ ESD Data

How to Create Symbols for PSpice Models

Power Loss and Thermal Design of Diodes

Precautions When Measuring the Rear of the Package with a Thermocouple

What is a Thermal Model? (Diode)

Condition of Soldering / Land Pattern Reference

Constitution Materials List

Two-Resistor Model for Thermal Simulation

Judgment Criteria of Thermal Evaluation

RB085T-60HZ Data Sheet

List of Diode Package Thermal Resistance

How to Select Rectifier Diodes

Notes for Temperature Measurement Using Forward Voltage of PN Junction

How to Use LTspice&reg; Models

Package Dimensions

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

RB085 Series

How to Use LTspice® Models: Tips for Improving Convergence

How to Use LTspice® Models