RF and Wireless

BGM210PA22JIA2R

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RF TXRX MOD BLUETOOTH CHIP SMD

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RF and Wireless

BGM210PA22JIA2R

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SILICON LABS

RF TXRX MOD BLUETOOTH CHIP SMD

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	BGM210PA22JIA2R

Antenna Type	Chip, Integrated
Current - Receiving [Max]	9.9 mA
Current - Receiving [Min]	9.1 mA
Current - Transmitting [Max] [x]	34.1 mA
Current - Transmitting [Min] [x]	16.1 mA
Data Rate	2 MBd
Frequency [Max]	2.4835 GHz
Frequency [Min]	2.4 GHz
Memory Size	1 MB, 96 kB
Modulation	GFSK
Mounting Type	Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	31-SMD Module
Power - Output	10 dBm
Protocol	Bluetooth v5.3
RF Family/Standard	Bluetooth
Sensitivity	-104.5 dBm
Serial Interfaces	I2S, ADC, SPI, PWM, GPIO, IrDA, I2C, UART
Utilized IC / Part	EFR32BG21
Voltage - Supply [Max]	3.8 V
Voltage - Supply [Min]	1.71 V

BGM210 Series

Part	Sensitivity	Memory Size	Current - Receiving [Min]	Current - Receiving [Max]	Power - Output	Protocol	Current - Transmitting [Min]	Current - Transmitting [Max]	Utilized IC / Part	Package / Case	Antenna Type	Serial Interfaces	Voltage - Supply [Max]	Voltage - Supply [Min]	Data Rate	Modulation	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	RF Family/Standard	Frequency [Max]	Frequency [Min]	Current - Transmitting [Min] [x]	Current - Transmitting [Max] [x]
SILICON LABS BGM210PA32JIA2	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	20 dBm	Bluetooth v5.3	59.7 mA	173 mA	EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.71 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz
SILICON LABS BGM210PA22JIA2	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	10 dBm	Bluetooth v5.3			EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.71 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz	16.1 mA	34.1 mA
SILICON LABS BGM210PA32JIA2R	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	20 dBm	Bluetooth v5.3	59.7 mA	173 mA	EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.71 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz
SILICON LABS BGM210P022JIA2R	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	10 dBm	Bluetooth v5.1			EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.8 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz	16.1 mA	34.1 mA
SILICON LABS BGM210PB32JIA2	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	20 dBm	Bluetooth v5.3	59.7 mA	173 mA	EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.71 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz
SILICON LABS BGM210PB22JIA2	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	10 dBm	Bluetooth v5.3			EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.71 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz	16.1 mA	34.1 mA
SILICON LABS BGM210P032JIA2	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	20 dBm	Bluetooth v5.1	59.7 mA	173 mA	EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.71 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz
SILICON LABS BGM210PA22JIA2R	-104.5 dBm	1 MB 96 kB	9.1 mA	9.9 mA	10 dBm	Bluetooth v5.3			EFR32BG21	31-SMD Module	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	3.8 V	1.71 V	2 MBd	GFSK	Surface Mount	125 °C	-40 °C	Bluetooth	2.4835 GHz	2.4 GHz	16.1 mA	34.1 mA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 5.66
	Tape & Reel (TR)	1000	$ 5.66

Description

General part information

BGM210 Series

Bluetooth Bluetooth v5.3 Transceiver Module 2.4GHz ~ 2.4835GHz Integrated, Chip Surface Mount

Documents

Technical documentation and resources